Liquid Jet Head Chip Electrode Isolation for Narrow Channel Pitch
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Solution Overview
Problem
Existing inkjet head technologies face challenges in maintaining inter-electrode distance while narrowing the pitch of channels to achieve high resolution, leading to potential short circuits and reduced reliability.
Innovation Solution
The head chip design includes an actuator plate with electrical conducting material removal areas formed by laser irradiation, ensuring inter-electrode distance through strategic electrode decoupling and reliable conduction via lateral connection parts and bonding films, enhancing durability and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the pitch of channels is narrowed to achieve high resolution, then the measurement precision is improved, but the inter-electrode distance cannot be ensured leading to potential short circuits
Solution Approach 1:
The patent introduces a non-conductive layer as an intermediary substance between adjacent electrodes during the electroless plating process. This mediator prevents conductive material from bridging between electrodes, allowing channels to be placed closer together without causing short circuits. The non-conductive layer is selectively removed after plating to reveal the electrode structure, thus enabling high resolution while maintaining reliability.
Solution Approach 2:
The patent applies preliminary protective measures by forming a non-conductive layer before the electroless plating process. This preliminary action prevents the harmful effect of conductive material bridging between electrodes during manufacturing. The non-conductive layer is deposited in advance on the actuator plate surface, creating a barrier that allows close channel spacing while ensuring electrode isolation is maintained throughout the manufacturing process.
2Measurement precision
If the pitch of channels is narrowed to achieve high resolution, then the measurement precision is improved, but the device complexity increases due to additional manufacturing steps
Solution Approach 1:
The patent merges the electrode formation process with the channel definition process by using the same actuator plate structure for both purposes. The non-conductive layer is applied to the entire actuator plate surface, and the electroless plating simultaneously forms both the electrode structures and defines the channel boundaries. This merging of functions reduces the need for separate manufacturing steps and simplifies the overall device complexity while achieving high resolution.
Solution Approach 2:
The actuator plate serves multiple functions: it provides the structural base for the device, defines the channel geometry, and serves as the substrate for electrode formation. The non-conductive layer also serves dual purposes by both preventing short circuits during manufacturing and potentially serving as part of the final device structure. This multi-functionality reduces the number of separate components and manufacturing steps required, thereby reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design maintains inter-electrode distance, prevents short circuits, and ensures reliable electrical conduction, resulting in a more durable and reliable liquid jet head and recording device.
Implementation Method 1
an electrical conducting material removal area in which a laser irradiation scar is formed throughout an entire area
Implementation Method 2
a voltage is applied between electrodes provided to the drive wall to cause the drive wall to make a thickness-shear deformation
Data Source
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AI summary
There are provided a head chip, a liquid jet head, a liquid jet recording device, and a method of manufacturing a head chip each capable of ensuring an inter-electrode distance of each of channels while achieving narrowing of a pitch of the channels. In the head chip according to an aspect of the present disclosure, an electrical conducting material removal area in which laser irradiation scars are formed throughout an entire area in an X direction of a portion located between a lower end opening of an ejection channel and a lower end opening of a non-ejection channel is disposed in a portion located between the lower end opening of the ejection channel and the lower end opening of the non-ejection channel in a lower surface of an actuator plate.