Head Chip Pad Placement for Nozzle Density
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Solution Overview
Problem
Existing head chips for inkjet printers face challenges in reducing size and increasing nozzle density due to the need for external wiring mounting areas, which limits the proximity of adjacent head chips and nozzle density.
Innovation Solution
The head chip design incorporates a pad formation surface overlapping the flow channel area, allowing for internal wiring mounting without external areas, and uses through holes to connect electrodes, reducing size and preventing mechanical crosstalk, while also increasing the electric field and pressure generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the mounting area for external wiring is disposed in the portion extending from the pressure chamber out of the actuator plate, then the external wiring can be mounted, but the planar size of the head chip increases
Solution Approach 1:
The invention moves the wiring mounting area from a planar extension (2D layout) to a position on the opposite surface of the actuator plate (3D utilization). By forming the mounting area on the surface opposite to the pressure chamber side, the wiring can be mounted without increasing the planar footprint of the head chip, thus resolving the contradiction between manufacturability and compact size.
2Ease of manufacture
If the mounting area is set between the head chips adjacent to each other, then the external wiring can be mounted, but the distance between adjacent head chips cannot be narrowed
Solution Approach 1:
The invention relocates the wiring mounting area from the lateral space between adjacent head chips to the opposite surface of each individual actuator plate. This vertical placement allows adjacent head chips to be positioned closer together in the planar direction while maintaining independent wiring access on each chip's rear surface.
3Area of moving object
If the pad formation surface is disposed on the opposite side to the flow channel member, then the head chip size is reduced, but the wiring connection path becomes more complex
Solution Approach 1:
The invention segments the actuator plate structure to include through-holes that penetrate from one surface to the other. These through-holes provide direct wiring paths from the opposite surface (where the mounting area is located) to the drive electrode on the pressure chamber side, simplifying the connection path despite the reversed mounting location.
Solution Approach 2:
The through-holes in the actuator plate serve as intermediary channels that facilitate the wiring connection between the mounting area on the opposite surface and the drive electrode on the pressure chamber side. This intermediary structure eliminates the need for complex lateral routing while maintaining the compact design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a reduction in head chip size, increased nozzle density, and improved manufacturing efficiency, enabling cost reduction and enhanced performance by allowing closer chip placement and efficient voltage application.
Implementation Method 1
an electric field is generated in an actuator plate formed of a piezoelectric material to thereby deform the actuator plate
Implementation Method 2
a so-called shear mode in which a shear deformation (a thickness-shear deformation) is caused in the actuator plate due to the electric field generated in the actuator plate
Data Source
AI summary
A head chip, a liquid jet head, and a liquid jet recording device each capable of achieving a reduction in size and an increase in nozzle density are provided. The head chip according to an aspect of the present disclosure includes a flow channel member having a flow channel formation area including a flow channel through which liquid flows, and a pressure chamber which is communicated with the flow channel, and in which the liquid is contained, an actuator plate which is stacked on the flow channel member in a state of being opposed to the pressure chamber in a first direction, a drive electrode which is formed on a surface facing to the first direction in the actuator plate, and which is configured to deform the actuator plate in the first direction so as to change a volume of the pressure chamber, and a pad which is formed on a pad formation surface, and which is coupled to the drive electrode, and on which external wiring is mounted, wherein the pad formation surface is an area overlapping the flow channel formation area when viewed from the first direction, and the pad formation surface is disposed so as to face to an opposite side in the first direction to the flow channel member.