Head Chip Drive Wiring with Variable Cross-Sections for Reliability

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Solution Overview

Problem

The existing head chip designs in inkjet printers suffer from electrode disconnection issues due to high electric resistance in the common electrode caused by dividing grooves, leading to reliability concerns.

Innovation Solution

The head chip design incorporates a drive wiring line with a first region and a second region of reduced cross-sectional area, connected by a second wiring part, to minimize resistance and prevent disconnection, while maintaining manufacturing efficiency and reducing material costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a dividing groove is formed in the actuator plate to separate individual terminal and common terminal, then terminal separation is achieved, but electric resistance in the common electrode increases causing disconnection risk

Engineering Contradiction:
Improveterminal separationVSAvoidelectrode connection reliability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent applies local quality by making the drive wiring line have different cross-sectional areas in different regions. Specifically, the first region has a larger cross-sectional area while the second region has a smaller cross-sectional area, allowing the wiring to adapt to the space constraints near the dividing groove while maintaining low resistance in the overall path. This local variation in geometry resolves the contradiction between terminal separation and connection reliability.

Inventive Principle:
Principle #3Local quality

2Area of stationary object

If the cross-sectional area of drive wiring line is reduced to fit space constraints, then space utilization improves, but electric resistance increases causing disconnection risk

Engineering Contradiction:
Improvewiring line cross-sectional areaVSAvoidwiring line connection reliability
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent makes different portions of the drive wiring line have different cross-sectional areas. The first region has a larger cross-sectional area to minimize resistance, while the second region has a smaller cross-sectional area to fit space constraints near the dividing groove. This local differentiation allows the wiring to satisfy both space utilization and connection reliability requirements.

Inventive Principle:
Principle #3Local quality

3Reliability

If a second wiring part is added to connect to the second region, then resistance is reduced, but device complexity increases

Engineering Contradiction:
Improvewiring line connection reliabilityVSAvoidwiring line structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the drive wiring line and the second wiring part into a single integrated structure. The second wiring part is formed as a continuation of the first wiring part, creating a unified drive wiring line that reduces resistance without requiring separate, discrete wiring components. This merging approach reduces device complexity while maintaining connection reliability.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the long-term reliability of the head chip by reducing resistance and preventing disconnection, even under high current conditions, without increasing size or capacitance.

Implementation Method 1

a voltage is applied between the common electrode and the individual electrode to cause a drive wall to make a thickness-shear deformation

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

the second region being smaller in cross-sectional area perpendicular to the extending direction than the first region, and a second wiring part connected to at least the second region

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20250269643A1Head chip, liquid jet head, liquid jet recording apparatus, and method of manufacturing head chip
Publication Date: 2025.08.28 SII PRINTEK INC
  • US20250269643A1 patent drawing
  • US20250269643A1 patent drawing
  • US20250269643A1 patent drawing

AI summary

A head chip, a liquid jet head, a liquid jet recording apparatus, and a method of manufacturing the head chip which prevent disconnection of a drive electrode and so on and are excellent in long-term reliability are provided. The head chip according to an aspect of the present disclosure includes a chip main body including a pressure chamber configured to retain a liquid and a drive unit disposed in a portion facing the pressure chamber, a drive electrode provided to the drive unit, and a drive wiring line which is provided to the chip main body, and is configured to couple the drive electrode and an external wiring line to each other. The drive wiring line includes a first wiring part including a first region, and a second region which is coupled the first region in an extending direction of the drive wiring line, and is smaller in cross-sectional area perpendicular to the extending direction than the first region, and a second wiring part connected to at least the second region in a direction crossing the extending direction.