Head Drive Circuit Layout for Fan Vibration Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing liquid discharge apparatuses face issues with discharge stability due to increased inductance in transmission lines and vibration-induced malfunctions from cooling fans, particularly when a substrate with a drive circuit is directly mounted above a head unit, which can lead to overheating and mechanical interference.
Innovation Solution
A drive circuit unit is designed with a first connector coupled to a head, a first substrate, a fan for cooling, and a second substrate on which the fan is mounted, separating the fan from the drive circuit to prevent vibration transmission and improve cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling fan is provided for each drive circuit, then cooling efficiency is improved, but vibration is transmitted to the drive circuit causing malfunctions
Solution Approach 1:
The patent divides the mounting structure into two separate substrates: a first substrate for mounting the drive circuit and a second substrate for mounting the cooling fan. This segmentation physically separates the fan from the drive circuit, preventing vibration transmission while maintaining cooling functionality. The drive circuit and cooling fan are mounted on different substrates, which are then coupled together, achieving both efficient cooling and vibration isolation.
Solution Approach 2:
The first substrate acts as an intermediary between the drive circuit and the cooling fan. By mounting the fan on a separate second substrate and coupling the two substrates, the patent introduces an intermediate structure that blocks vibration transmission from the fan to the drive circuit while still allowing thermal management to function effectively.
2Length of moving object
If the substrate is disposed directly above the head, then transmission line length is reduced, but discharge stability deteriorates due to increased inductance
Solution Approach 1:
The patent addresses the inductance issue by changing the spatial arrangement of components. Instead of simply reducing transmission line length in one dimension, the patent uses a three-dimensional substrate stacking configuration where the drive circuit substrate is positioned above the head at an angled orientation. This dimensional change allows for optimized signal transmission paths that reduce inductance effects while maintaining compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances discharge stability and reduces the risk of malfunctions by isolating the drive circuit from vibration sources while maintaining effective cooling, thereby improving the reliability and performance of the liquid discharge apparatus.
Implementation Method 1
a fan that generates wind for cooling the drive circuit
Data Source
AI summary
Provided is a drive circuit unit generating a drive signal for driving a head, the drive circuit unit including: a drive circuit generating the drive signal; a first connector coupled to the head; a first substrate on which the first connector is mounted; a fan generating wind for the drive circuit; and a second substrate on which the fan is mounted.