Head Module Fan Nesting Inside Heat Sink Fins

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Solution Overview

Problem

The existing print head designs face limitations in miniaturization due to the restricted arrangement and size of fans and heat sinks within the head module, as they must avoid interfering with the radiator fins, resulting in limited space efficiency.

Innovation Solution

A liquid discharging head module is designed with a heat sink that includes a base part and multiple fins extending from it, allowing the fan to be positioned in a way that overlaps with the base part and is surrounded by the fins, enhancing space efficiency and enabling compact arrangement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the fan is arranged to avoid interfering with the radiator fins, then the cooling function is maintained, but the space efficiency is reduced and miniaturization is limited

Engineering Contradiction:

Improvecooling functionVSAvoidhead module size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The fan is nested within the inner space of the heat sink, specifically positioned in the region surrounded by the fins. This allows the fan to be housed inside the heat sink structure itself, maximizing space utilization and enabling miniaturization of the overall head module while maintaining both cooling function and compact dimensions

Inventive Principle:

Principle #7Nested doll (Nesting)

2Shape

If the fan is arranged at positions not interfering with the radiator fins, then the radiator fin arrangement is maintained, but the freedom of fan arrangement and fan size are restricted

Engineering Contradiction:

Improveradiator fin arrangementVSAvoidfan arrangement freedom

Core Design Contradiction:

ShapeVSAdaptability or versatility

Solution Approach 1:

The design utilizes the third dimension (depth) by arranging the fan in the inner space of the heat sink rather than only in the planar arrangement. This dimensional change provides new freedom for fan placement and size selection without compromising the radiator fin arrangement, as the fan operates in the vertical space within the heat sink structure

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the space efficiency of the head module, allowing for miniaturization while maintaining effective cooling performance, as the fan's airflow can efficiently dissipate heat without overlapping with the driver IC and optimizing the layout for compactness.

Implementation Method 1

a heat sink thermally connected to the driver IC

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a fan arranged on one side in a first direction with respect to the heat sink

Methodology Applied

Scientific EffectForced convection: Forced Convection

Data Source

PatentUS11235605B2Head module and head unit

Publication Date: 2022.02.01 BROTHER KOGYO KK

AI summary

There is provided a head module including: a liquid discharging head; a driver IC; a heat sink; and a fan. The head module includes: a channel unit; and an energy-applying mechanism. The heat sink includes: a base part; and a plurality of fins including: a first fin, a second fin, and a third fin. A plane direction of a plane in which the first fin expands crosses a plane direction of a plane in which the second fin expands, and crosses a plane direction of a plane in which the third fin expands. The fan is arranged at a position at which the fan overlaps with the base part in the first direction, and in a space surrounded by the first fin, the second fin, the third fin and the base part.