Head Module Heat Dissipation Member Design for Liquid Discharge Apparatus

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Solution Overview

Problem

Existing head modules for liquid discharge apparatuses face challenges in effective heat dissipation and structural stability due to thermal expansion, leading to potential deformation and variations in discharge characteristics.

Innovation Solution

A head module design featuring a heat dissipation member made of high thermal conductivity materials, such as aluminum, silver, or copper, thermally coupled to drive circuits and positioned between liquid discharge heads to dissipate heat efficiently while minimizing size and deformation risks, with a base material having a low coefficient of linear expansion to maintain nozzle alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a reinforcing member is disposed above the liquid discharge head with point contact on protrusions, then structural support is provided, but heat dissipation effectiveness is reduced and deformation occurs due to thermal expansion

Engineering Contradiction:
Improveheat dissipation effectivenessVSAvoidstructural stability
Core Design Contradiction:
TemperatureVSStability of the object's composition

Solution Approach 1:

The base is divided into a heat dissipation member (first region) and a support member (second region), with each having distinct functions. The heat dissipation member contacts the liquid discharge head over a larger area for effective heat transfer, while the support member provides structural stability through point contact on protrusions. This segmentation resolves the contradiction by separating heat dissipation and support functions into different structural zones.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the base are given different material properties and functions: the first region (heat dissipation member) is designed for high thermal conductivity and large contact area with the liquid discharge head, while the second region (support member) is designed for mechanical strength and point contact. This local differentiation allows simultaneous optimization of heat dissipation and structural stability without compromise.

Inventive Principle:
Principle #3Local quality

2Temperature

If the base material has high thermal conductivity, then heat dissipation is improved, but thermal expansion causes deformation and nozzle alignment variations

Engineering Contradiction:
Improveheat dissipationVSAvoidnozzle alignment
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The base is segmented into a heat dissipation member and a support member with distinct functions. The heat dissipation member handles thermal management, while the support member maintains structural stability and nozzle alignment. This segmentation allows the system to achieve effective heat dissipation without compromising manufacturing precision, as the support structure is designed to minimize thermal expansion effects.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support member acts as an intermediary between the heat dissipation member and the liquid discharge head, providing mechanical support while isolating the precision-critical nozzle assembly from thermal expansion effects. This intermediary structure allows heat dissipation to occur without directly transmitting thermal stress to the nozzle alignment system.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Temperature

If the heat dissipation member contacts the liquid discharge head over a large area, then heat dissipation is enhanced, but the risk of deformation increases due to thermal stress

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidresistance to deformation
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The base structure is segmented into a heat dissipation member that provides large-area contact for heat dissipation and a support member that provides structural reinforcement. This segmentation allows the system to achieve both enhanced heat dissipation and resistance to deformation, as the support member compensates for thermal stress while the heat dissipation member maintains efficient thermal contact.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The base is constructed as a composite structure combining materials with different properties: the heat dissipation member uses high thermal conductivity materials for heat transfer, while the support member uses materials with high strength and low thermal expansion for structural stability. This composite approach resolves the contradiction between heat dissipation efficiency and deformation resistance.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances heat dissipation, reduces temperature variations, and maintains consistent discharge characteristics by stabilizing the heat dissipation member's posture and preventing base deformation through strategic contact points and materials selection.

Implementation Method 1

a heat dissipation member thermally coupled to the plurality of drive circuits

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a base material having a low coefficient of linear expansion to maintain nozzle alignment

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS10836190B2Head module, head device, and liquid discharge apparatus
Publication Date: 2020.11.17 RICOH CO LTD
  • US10836190B2 patent drawing
  • US10836190B2 patent drawing
  • US10836190B2 patent drawing

AI summary

A head module includes a base, a plurality of heads mounted on the base, a plurality of wiring members connected to the plurality of heads, the plurality of wiring members mounting a plurality of drive circuits, respectively, and a heat dissipation member thermally coupled to the plurality of drive circuits. The heat dissipation member is disposed facing the plurality of heads and the base, and the heat dissipation member contacts the base at a position between adjacent heads of the plurality of heads.