Head Module Heat Insulator Prevents Thermal Deformation
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Solution Overview
Problem
The direct bonding of a resin-made or plastic enclosure case to a heat sink in semiconductor modules can lead to deformation due to heat, creating gaps that allow mist from liquid ejection to reach the chip-mounted board, potentially causing short-circuit failures.
Innovation Solution
A heat insulator with lower thermal conductivity than the heat spreader is placed between the heat spreader and the holder, featuring clamp portions, a connecting portion, and a frame portion with elasticity to securely hold the heat spreader and prevent deformation, ensuring effective sealing and reducing thermal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the holder is directly bonded to the heat spreader, then assembly is simplified, but the holder deforms due to heat from the heat spreader
Solution Approach 1:
A heat insulator is introduced as an intermediary component between the holder and the heat spreader. This heat insulator has low thermal conductivity to block heat transfer from the heat spreader to the holder, preventing thermal deformation of the holder while maintaining the bonded assembly structure.
2Device complexity
If the holder is directly bonded to the heat spreader, then manufacturing steps are reduced, but gaps form allowing mist to reach the chip-mounted board
Solution Approach 1:
The heat insulator serves as a sealing intermediary that fills the gap between the holder and heat spreader, preventing mist from penetrating through to the chip-mounted board while maintaining structural integrity and reducing the number of separate sealing components needed.
3Temperature
If a heat insulator is added between the holder and heat spreader, then thermal transfer is reduced, but assembly complexity increases
Solution Approach 1:
The heat insulator is designed with specific physical parameters including elasticity to enable deformation during assembly, clamp portions for mechanical engagement, and a connecting portion for secure attachment. These parameter optimizations allow the heat insulator to be integrated into the assembly without significantly increasing complexity while maintaining effective thermal insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents deformation of the holder, reduces the risk of short-circuit failures by blocking mist entry and maintaining seal integrity, and facilitates easier assembly of the head module.
Implementation Method 1
The heat insulator has a thermal conductivity lower than the heat spreader. This may reduce thermal transfer between the heat spreader and the holder, and may prevent deformation of the holder due to the heat from the heat spreader.
Data Source
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AI summary
A head module 10m includes a head 11, a pair of driver ICs 12, a holder 13 that supports the head 11, a head spreader 14 in thermal communication with the pair of the driver ICs 12 and a heat insulator 15 located between the heat spreader 14 and the holder 15. The heat insulator 15 has a thermal conductivity lower than the heat spreader 14.