Head Module Heat Spreader Layout for Thermal Management
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Solution Overview
Problem
In conventional head modules for liquid jetting apparatuses, the carriage substrate can hinder heat radiation by the heat sink, leading to inefficient thermal management.
Innovation Solution
A head module configuration where the driver ICs are arranged between the head and the heat spreader, with a rigid substrate having higher rigidity than the flexible substrate, positioned side by side with the heat spreader in a direction orthogonal to the nozzle surface, minimizing overlap and preventing heat radiation hindrance, while maintaining a compact size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the carriage substrate is located above the heat sink and overlaps with it in the up-down direction, then the substrate can be connected to the circuit board, but the substrate hinders or inhibits the radiation of heat by the heat sink
Solution Approach 1:
The patent transitions from vertical stacking (substrate above heat sink) to side-by-side arrangement in the width direction. This dimensional change eliminates overlap in the up-down direction while maintaining electrical connections through the flexible substrate, thereby resolving the heat radiation hindrance issue.
Solution Approach 2:
The patent divides the substrate structure into a flexible substrate for electrical connections and a rigid substrate for structural support. The flexible substrate can extend laterally to connect driver ICs without requiring vertical stacking, enabling side-by-side arrangement that prevents heat radiation obstruction.
2Device complexity
If the driver ICs are arranged above the recording head, then the heat spreader can be positioned above the driver ICs, but this arrangement causes the carriage substrate to overlap with the heat spreader and hinder heat radiation
Solution Approach 1:
The patent rearranges components from a vertical stack (head → driver ICs → heat spreader → substrate) to a lateral configuration where the rigid substrate and heat spreader are positioned side by side in the width direction. This eliminates vertical overlap and allows the heat spreader to function effectively without substrate obstruction.
Solution Approach 2:
The flexible substrate acts as an intermediary that connects the driver ICs to the rigid substrate without requiring direct vertical stacking. This allows the driver ICs to be positioned between the head and heat spreader while maintaining electrical connections through the flexible intermediary, enabling the side-by-side arrangement.
3Temperature
If the rigid substrate and heat spreader are arranged side by side in the short direction of the nozzle surface, then heat radiation is not hindered, but the thickness of the rigid substrate is required along the short direction
Solution Approach 1:
The patent changes the orientation parameter of the rigid substrate, positioning its thickness along the short direction of the nozzle surface rather than the longitudinal direction. This parameter change enables the side-by-side arrangement with the heat spreader in the width direction, preventing heat radiation hindrance while accommodating the substrate's dimensional requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents heat radiation hindrance and maintains a compact size for the head module, ensuring efficient thermal management and performance.
Implementation Method 1
a heat spreader thermally making contact with the plurality of driver ICs
Data Source
AI summary
There is provided a head module including: a head which has an inlet, a plurality of nozzles, and a plurality of driving elements, and in which the nozzles are aligned in rows in a longitudinal direction of a nozzle surface orthogonal to a attaching/detaching direction of the head module; a plurality of driver ICs; a heat spreader; a flexible substrate; and a rigid substrate. In the attaching/detaching direction, the driver ICs are arranged between the head and the heat spreader; the rigid substrate and the head are arranged side by side in the attaching/detaching direction; the rigid substrate and the heat spreader are arranged side by side in a short direction of the nozzle surface; and the rigid substrate has a thickness along the short direction of the nozzle surface.