Liquid Ejecting Head Module Width Reduction via Relay Substrate
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Solution Overview
Problem
There is a demand for further size reduction of liquid ejecting head modules without compromising the rigidity of the metal frame, particularly when unit heads are fixed to both side surfaces, requiring a solution to minimize the width of the head module while maintaining structural integrity.
Innovation Solution
The configuration includes a unit head with a nozzle surface, a pressure generator, and a wiring member that connects the pressure generator to a drive substrate, where the unit head has a first portion with a nozzle surface and a second portion with a contact portion fastened to the fixation member, allowing the nozzles to be positioned closer together, and the wiring member is routed efficiently from the pressure generator to the drive substrate without bending, using a relay substrate to shorten the wiring length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If unit heads are fixed to both side surfaces of the metal frame, then the structural stability is improved, but the width of the head module increases
Solution Approach 1:
The patent repositions the contact portion of the unit head's second portion closer to the surface of the fixation member in the thickness direction, effectively moving elements along the Z-axis to reduce the X-direction width while preserving the dual-side fixation structure for stability
2Length of moving object
If the contact portion is positioned closer to the fixation member surface, then the width direction size is reduced, but the wiring member routing becomes more complex
Solution Approach 1:
The unit head is divided into a first portion (nozzle surface side) and a second portion (contact portion side), allowing independent optimization of each section's position and function, which simplifies the overall wiring routing by separating the nozzle assembly from the contact and wiring interface
3Productivity
If the first portion is positioned further on the liquid ejecting side, then the nozzle arrangement is optimized, but the thickness direction dimensions increase
Solution Approach 1:
The patent optimizes the position of the first portion along the liquid ejecting direction (X-axis) rather than increasing the thickness direction (Z-axis) dimensions, effectively repositioning elements in a different dimension to achieve better nozzle arrangement without increasing overall module thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a smaller head module size in the thickness direction without reducing the rigidity of the fixation member, improves wiring efficiency, and reduces costs by shortening the wiring length, while maintaining position accuracy of the unit heads.
Implementation Method 1
a pressure generator creating a change in the liquid pressure in the liquid flow path, and which ejects the liquid in the liquid flow path from the nozzle by driving the pressure generator
Data Source
AI summary
A unit head has a head main body having a nozzle surface, and a substrate case having a fastening surface fastened to a fixation frame of a frame and accommodating a relay substrate. The fastening surface of a substrate case is formed at a position closer to a surface of an opposite side to a fixation frame than a side surface of a fastening surface side of the head main body, and the head main body is positioned further at an ink ejecting side than the fixation frame with the faster surface being fixed to the fixation frame, the other end of a first cable whose one end is connected to the electrode terminal of a piezoelectric element is connected to the relay substrate, a second cable connected to the relay substrate is drawn to an opposite side to a nozzle surface from a position close to a surface of an opposite side to the fastening surface, and the other end of the second cable is connected to a drive substrate.