Head-Mountable Display Thermal Management via Dual Fan Airflow
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Solution Overview
Problem
Existing head mountable computer systems for augmented and virtual reality struggle with effective heat management, leading to reduced performance and increased risk of thermal damage.
Innovation Solution
The proposed head-mountable device incorporates a dual fan assembly with thermally coupled housings to the printed circuit board, along with a heat sink, to enhance airflow and dissipate heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If head mountable display systems operate continuously, then productivity and performance are maintained, but heat accumulation increases leading to thermal damage
Solution Approach 1:
The patent extracts the heat dissipation function from the general device structure by introducing dedicated cooling components including fans, heat sinks, and cooling channels. These components are specifically positioned to remove heat from critical areas such as the processor and display, enabling continuous operation without thermal damage.
Solution Approach 2:
The patent introduces cooling channels filled with cooling fluid as an intermediary heat transfer medium. This cooling fluid circulates between the heat-generating components and heat sinks, absorbing heat from components and releasing it through dedicated exhaust ports, thereby mediating the thermal management process.
2Temperature
If cooling components are added to manage heat, then temperature control improves, but device complexity increases
Solution Approach 1:
The patent merges multiple cooling functions into an integrated system where fans, heat sinks, and cooling channels work together as a unified thermal management solution. The housing structure itself is designed with integrated cooling channels, eliminating the need for separate external cooling components and reducing overall system complexity.
Solution Approach 2:
The housing structure serves multiple functions simultaneously: it provides mechanical support, contains the display and processor, and incorporates cooling channels for thermal management. This multi-functionality reduces the need for additional dedicated cooling components, thereby limiting the increase in device complexity.
3Temperature
If heat sinks and fans are positioned close to components, then heat dissipation effectiveness increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the cooling system into modular components including separate fans, heat sinks, and cooling channels that can be manufactured independently. These modules are then assembled in the housing, allowing for standardized manufacturing processes and reducing the precision requirements for individual component fabrication while maintaining effective heat dissipation through proper assembly positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat management, maintaining optimal performance and extending the lifespan of the device by effectively dissipating heat away from critical components.
Implementation Method 1
a fan assembly. In some examples, the fan assembly can include a first fan disposed in the internal volume and aligned with the first aperture and a second fan disposed in the internal volume and aligned with the second aperture. The first fan and the second can be configured to draw air into the internal volume through the intake port and push the air out from the internal volume through the exhaust port.
Implementation Method 2
the first fan can include a first housing thermally coupled to the printed circuit board. Furthermore, a second fan can include a second housing thermally coupled to the printed circuit board.
Implementation Method 3
the head-mountable device can further include a heat sink that can be disposed in the internal volume and a fan assembly
Implementation Method 4
the curtain assembly can include an elastic layer that can define an external surface. The curtain assembly can also include an air-impermeable layer that can define the internal volume.
Data Source
AI summary
A head-mountable device can include an outer frame that can define a first opening, a second opening an internal volume between the first opening and the second opening, an intake port between the first opening and the second opening, and an exhaust port between the first opening and the second opening. In some examples, a front cover assembly can be disposed in the first opening. An inner frame can be coupled to the outer frame, where the inner frame can also define a first aperture and a second aperture. In some examples, a curtain assembly can occlude the second opening. Furthermore, the curtain assembly can include an elastic layer that can define an external surface. The curtain assembly can also include an air-impermeable layer that can define the internal volume.