Head-Mounted Display Housing With Infrared Radiation Cooling
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Solution Overview
Problem
Wearable display devices face challenges in heat dissipation due to limited space and weight constraints, which affect user experience and safety compliance, especially when using passive heat dissipation methods.
Innovation Solution
A head-mounted display device design incorporating an infrared transmitting material for the heat dissipating walls, allowing heat transfer through radiation to increase the radiation heat dissipation area, combined with a heat dissipating module that transfers heat from the heat sources to the outside via thermal conduction and radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If passive heat dissipating elements are adopted, then the device structure is simple and noise-free, but the heat dissipation ability is significantly limited
Solution Approach 1:
The patent changes the material parameter of the housing wall to infrared transmitting material, which allows infrared radiation to pass through. This parameter change enables the housing itself to serve as a heat dissipation component without adding complex active cooling structures, resolving the contradiction between simple structure and effective heat dissipation.
Solution Approach 2:
The housing wall serves dual functions: it provides structural support and simultaneously acts as a heat dissipation component by transmitting infrared radiation. This multi-functionality eliminates the need for separate complex heat dissipation structures while maintaining effective passive cooling.
2Object-affected harmful factors
If the radiation heat dissipation area is increased, then heat dissipation efficiency is improved, but the device size and weight increase
Solution Approach 1:
The housing wall serves dual functions: structural support and heat dissipation surface. By making the housing wall itself infrared transmitting, the patent utilizes the existing structural component for heat dissipation without adding separate weighty heat dissipation components, thus improving heat dissipation efficiency without increasing device weight.
Solution Approach 2:
The patent merges the structural housing with the heat dissipation function by using infrared transmitting material for the housing wall. This combination allows the same component to fulfill both structural and thermal management roles, increasing radiation heat dissipation area without proportionally increasing weight.
3Object-affected harmful factors
If the radiation heat dissipation area is increased, then heat dissipation efficiency is improved, but the device size increases
Solution Approach 1:
The housing wall serves dual functions as both structural support and heat dissipation surface. By utilizing the existing housing structure for radiation heat dissipation, the patent increases the effective heat dissipation area without needing to add separate heat dissipation components that would increase device size.
Solution Approach 2:
The patent combines the structural housing with the heat dissipation function by using infrared transmitting material. This merging allows the same space to serve both structural and thermal management purposes, improving heat dissipation efficiency without proportionally increasing device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency, maintaining surface temperatures below safety limits while improving display quality and user experience.
Implementation Method 1
The material of the at least one heat dissipating wall is an infrared transmitting material... Heat generated by the at least one heat source is transferred to the heat dissipating module and is transferred from the at least one heat dissipating wall to an outside of the housing by radiation
Implementation Method 2
Heat generated by the at least one heat source is transferred to the heat dissipating module and is transferred from the at least one heat dissipating wall
Data Source
AI summary
A head-mounted display device includes a housing, an optical engine module, and a heat dissipating module. The housing has a display portion and a support portion. The display portion has a first space. The support portion has a second space communicated with the first space. The support portion has a side wall and a heat dissipating wall. A material of the heat dissipating wall is an infrared transmitting material and different from a material of the side wall. The optical engine module includes a heat source and is disposed in the first space. A part of the heat dissipating module is disposed in the first space and connected to the heat source. Another part of the heat dissipating module is disposed in the second space. Heat generated by the heat source is transferred to the heat dissipating module and transferred to an outside of the housing by radiation.