Head-Mounted Temperature Adjustment Device Using Semiconductor Cooling
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Solution Overview
Problem
Existing headwear lacks the ability to adjust temperature, failing to cool or warm the head effectively while providing sunshade or wind protection.
Innovation Solution
A head-mounted temperature adjustment device incorporating a cap body, a temperature conduction sheet, and a temperature adjustment assembly with a semiconductor temperature adjustment member and fan, allowing switching between cooling and heating modes by thermal conduction and ventilation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a semiconductor temperature adjustment member is used to cool or warm the head, then temperature adjustment function is achieved, but local overcooling or overheating may occur causing bad user experience
Solution Approach 1:
The patent applies local quality by using a temperature conduction sheet with temperature equalization characteristics to distribute the thermal energy from the semiconductor temperature adjustment member across different areas of the head. This ensures that the cooling or heating effect is uniformly distributed rather than concentrated at a single point, thereby preventing local overcooling or overheating and improving user experience.
2Temperature
If the semiconductor temperature adjustment member generates heat or cold, then temperature adjustment is achieved, but heat dissipation is required to maintain efficiency
Solution Approach 1:
The patent uses a temperature conduction sheet as an intermediary between the semiconductor temperature adjustment member and the head. This sheet not only transfers the thermal energy uniformly but also facilitates efficient heat dissipation from the semiconductor component to the surrounding environment, maintaining the component's operational efficiency while achieving the desired temperature adjustment effect.
3Object-affected harmful factors
If existing caps are used for sunshade or wind protection, then protection function is achieved, but temperature adjustment capability is lacking
Solution Approach 1:
The patent integrates multiple functions into a single cap product. The cap body provides traditional sunshade and wind protection functions, while the integrated semiconductor temperature adjustment member and temperature conduction sheet add active temperature adjustment capability. This multi-functional design allows the cap to adapt to different environmental conditions and user needs, whether for sun protection, wind protection, or active cooling/heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device provides uniform temperature adjustment to the head, preventing local overcooling or overheating by using a semiconductor temperature adjustment member and fan for efficient heat dissipation, enabling effective cooling in hot weather and warming in cold weather.
Implementation Method 1
the temperature conduction sheet and the semiconductor temperature adjustment member are thermally conducted
Implementation Method 2
a fan blows out or extracts the heat generated by the side of the semiconductor temperature adjustment member facing away from the human head
Data Source
AI summary
Disclosed is a head-mounted temperature adjustment device, including a cap body, a temperature conduction sheet, and a temperature adjustment assembly. The temperature adjustment assembly includes a semiconductor temperature adjustment member and a fan, the temperature conduction sheet and the semiconductor temperature adjustment member are thermally conducted and both disposed in the cap body, the temperature conduction sheet is located on a side of the semiconductor temperature adjustment member facing a human head, and the fan is disposed on a side of the semiconductor temperature adjustment member facing away from the human head. In the above solution of the present disclosure, the head-mounted temperature adjustment device can be switched between a cooling mode and a heating mode to warm or cool the human head.