Head-Side Feeder for Electronic Circuit Component Mounting
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Solution Overview
Problem
Existing electronic circuit component mounting systems face inefficiencies in mounting operations due to the need to move mounting devices to multiple feeders and simultaneous loading and preparation processes, which can lead to reduced operational efficiency and increased deviation during component placement.
Innovation Solution
An electronic circuit component mounting system that uses a mounting head with multiple nozzle holders and a head-side feeder system, where the component holding tool contacts the component at a pickup position and the circuit substrate during mounting, optimizing the component reception order and simultaneous mounting of tape and bulk components to improve efficiency and reduce deviation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple bulk feeders are used to supply electronic circuit components, then component supply capacity is improved, but the mounting device must move to each feeder which reduces mounting operation efficiency
Solution Approach 1:
Multiple bulk feeders are merged into a single integrated head-side feeder that is positioned on the mounting head. This allows multiple component types to be supplied from one location, eliminating the need for the mounting device to move between multiple separate feeders while maintaining the capacity to supply various electronic circuit components.
Solution Approach 2:
The feeder system is transitioned from a main-body-side configuration to a head-side configuration, changing the spatial dimension of component supply. By positioning the feeder on the mounting head itself, the system enables simultaneous access to multiple component types without requiring lateral movement between feeders.
2Productivity
If simultaneous loading and mounting preparation operations are performed, then operational efficiency is improved, but device complexity increases
Solution Approach 1:
The system enables continuous operation by performing board loading and mounting preparation simultaneously. While the board is being loaded onto the mounting head, the mounting preparation operations are conducted in parallel, ensuring that no time is wasted and the mounting process flows continuously without interruption.
3Manufacturing precision
If the component holding tool contacts the component at pickup position and the substrate during mounting, then mounting precision is improved, but the need for device movement increases
Solution Approach 1:
The component pickup and mounting functions are extracted and integrated into the mounting head, eliminating the need for separate pickup and mounting operations. The component holding tool is positioned to contact the component at the pickup position and then directly place it on the substrate, reducing intermediate movements while maintaining precision through controlled contact points.
Data Source
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AI summary
A mounting method is improved by an electronic circuit component mounter including a circuit substrate conveying and holding device, and a bulk feeder 90 that is a head-side feeder which can be moved to any position on a plane inside the mounter. An electronic circuit component mounting system including a control device that performs control such that that the component holding tool positioned at a component pickup position for a component supplied from the head-side feeder and an electronic component contact each other, and the electronic circuit component and the head-side feeder contact each other during contact between the component holding tool positioned at a component mounting position and an electronic circuit component and during contact between the electronic circuit component and the circuit substrate.