Liquid Discharge Head Unit Layout for Compact Heat Dissipation
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Solution Overview
Problem
Existing liquid discharge apparatuses, such as ink jet printers, face challenges in minimizing the size of the head unit due to the need for heat radiation members between adjacent heads, which prevents them from being placed close together, and the inability to position flow path members directly above the heads.
Innovation Solution
A head unit design that includes flexible wiring substrates with drive circuits and heat radiation members, allowing for overlapping and non-overlapping configurations of heads, and a heat transfer mechanism to efficiently dissipate heat generated by drive circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat radiation members are provided for each drive IC to radiate heat, then heat dissipation is improved, but the heads cannot be disposed close to each other, increasing the size of the head unit
Solution Approach 1:
The patent merges the heat radiation function by providing a single heat radiation member that serves multiple drive ICs instead of having separate heat radiation members for each drive IC. This consolidation allows the heads to be disposed closer together, reducing the overall head unit size while maintaining effective heat dissipation for all drive circuits.
2Device complexity
If COF substrates are drawn out straight above the head, then electrical connection is simplified, but flow path members cannot be disposed directly above the head
Solution Approach 1:
The patent resolves the positioning conflict by drawing out the COF substrates in a lateral direction parallel to the head rather than vertically above it. This dimensional change in the routing path allows flow path members to be disposed directly above the head while maintaining electrical connections to the drive circuits through the laterally extended COF substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables a compact head unit configuration that allows for closer head placement, reduces size, and improves versatility and cost-effectiveness by sharing heat radiation members and optimizing heat transfer, thereby enhancing the efficiency of the liquid discharge apparatus.
Implementation Method 1
a first heat transfer member thermally coupled to the first drive circuit and the first heat radiation member, and transferring heat generated by the first drive circuit to the first heat radiation member
Implementation Method 2
a first heat radiation member thermally coupled to the second drive circuit, and not thermally coupled to the first drive circuit
Data Source
AI summary
A first flexible wiring substrate having one end coupled to a first head side terminal of the first head, drawn out from one side of the first head in the first direction, and provided with a first drive circuit, a second flexible wiring substrate having one end coupled to the second head side terminal of the first head, drawn out from the other side of the first head in the first direction, and provided with a second drive circuit, a first heat radiation member thermally coupled to the second drive circuit, and not thermally coupled to the first drive circuit, and a first heat transfer member thermally coupled to the first drive circuit and the first heat radiation member, and transferring heat generated by the first drive circuit to the first heat radiation member.