Head Unit Heat Sink with Elastic Thermal Interface for Liquid Discharge
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Solution Overview
Problem
The increasing number of nozzles in liquid discharge apparatuses for high-definition image formation leads to higher current demands, resulting in increased heat generation in the driving signal output circuit, which accelerates component aging, affects ink properties, and deteriorates the apparatus's reliability, with existing heat dissipation methods being insufficient for efficient heat release without increasing the device's size.
Innovation Solution
A head unit with a dual driving element system, including a substrate with integrated circuits, amplifiers, and smoothing circuits, and a heat sink, where heat conductive elastic bodies are used to enhance heat dissipation by positioning them between the substrate and the heat sink, allowing for efficient heat transfer and management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the number of nozzles is increased to achieve high-definition image formation, then the discharge speed and image quality are improved, but the current demand and heat generation in the driving signal output circuit increase
Solution Approach 1:
The driving signal output circuit is divided into multiple independent amplifier circuits (first amplifier circuit and second amplifier circuit), each handling a subset of nozzles. This segmentation reduces the current burden and heat generation in each individual amplifier while maintaining the overall high-definition output capability through coordinated operation of multiple amplifiers.
2Measurement precision
If the operating frequency of the driving signal output circuit is increased to improve driving accuracy, then the waveform accuracy is improved, but the heat generation increases
Solution Approach 1:
The high-frequency driving signal generation is segmented across multiple amplifier circuits operating in parallel. Each amplifier operates at high frequency for its assigned nozzles, maintaining waveform accuracy, while the distributed architecture prevents excessive heat concentration in a single circuit.
3Productivity
If the number of nozzles is increased to respond to high-definition demand, then the discharge speed is improved, but the amount of current output increases
Solution Approach 1:
The nozzle group is divided into multiple subsets, each served by a dedicated amplifier circuit. This allows high-speed discharge across all nozzles through parallel operation, while each amplifier handles only a portion of the total current, reducing the power burden per circuit.
Solution Approach 2:
The system transitions from a single-series amplifier architecture to a multi-parallel amplifier architecture, adding the dimension of parallel processing. This enables simultaneous high-speed discharge from multiple nozzles while distributing the current load across multiple independent current paths.
4Temperature
If conventional heat dissipation methods are used, then some heat release is achieved, but the heat dissipation efficiency is insufficient without increasing device size
Solution Approach 1:
The heat dissipation function is merged with the existing substrate structure by forming heat dissipation holes that extend through the substrate to expose heat-generating components. This integration allows efficient heat release without adding separate external heat dissipation components, maintaining compact device size.
Solution Approach 2:
The substrate is transformed into a porous structure with multiple heat dissipation holes distributed throughout. This porous configuration increases the surface area for heat exchange and provides multiple thermal pathways, significantly improving heat dissipation efficiency within the same volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces heat generation and improves the reliability and accuracy of the liquid discharge apparatus by efficiently dissipating heat, thereby extending component lifespan and maintaining high-definition image quality.
Implementation Method 1
heat conductive elastic bodies positioned between the substrate and the heat sink
Data Source
AI summary
There are provided a substrate on which a first integrated circuit, a first transistor, a second integrated circuit, and a second transistor are disposed; a heat sink fixed to the substrate; a first heat conductive elastic body which is in contact with the heat sink and the first integrated circuit; a second heat conductive elastic body which is in contact with the heat sink and the first transistor; a third heat conductive elastic body which is in contact with the heat sink and the second integrated circuit; and a fourth heat conductive elastic body which is in contact with the heat sink and the second transistor, the heat sink has a first recess portion positioned between the first heat conductive elastic body and the second heat conductive elastic body, and a second recess portion positioned between the third heat conductive elastic body and the fourth heat conductive elastic body.