Head Unit Heat Sink Segmentation for Liquid Discharge Thermal Management
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Solution Overview
Problem
The increasing number of nozzles in liquid discharge apparatuses for high-definition image formation leads to higher current output by the driving signal output circuit, resulting in increased heat generation, which accelerates component aging, affects ink properties, and deteriorates apparatus reliability, with existing heat dissipation technologies being insufficient for efficient heat release.
Innovation Solution
A head unit with a dual driving element system, including a substrate with integrated circuits and transistors, and a heat sink connected via heat conductive elastic bodies to enhance heat dissipation, specifically positioning these components to optimize heat transfer and reduce thermal issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of nozzles is increased to achieve high-definition image formation, then the discharge speed and definition are improved, but the current output by the driving signal output circuit increases, resulting in increased heat generation that accelerates component aging and deteriorates apparatus reliability
Solution Approach 1:
The patent divides the driving signal output circuit into multiple independent amplifier circuits (first amplifier circuit and second amplifier circuit), each responsible for driving specific nozzle groups. This segmentation reduces the current burden on each amplifier, thereby reducing heat generation per component while maintaining the ability to drive a large number of nozzles for high-definition output.
Solution Approach 2:
The patent introduces a signal distribution structure that acts as an intermediary between the control unit and the piezoelectric elements. This intermediary distributes signals to different amplifier circuits, enabling efficient current management and heat dissipation across multiple channels, thus maintaining reliability while supporting high productivity.
2Manufacturing precision
If the operating frequency of the driving signal output circuit is increased to improve waveform accuracy for high-definition output, then the driving accuracy of the piezoelectric element is improved, but the amount of current output and heat generation further increase
Solution Approach 1:
The patent segments the high-frequency driving signals into multiple amplifier circuits operating at optimized frequencies. Each amplifier handles a portion of the total signal load, allowing high waveform accuracy to be maintained across all channels without concentrating excessive current and heat in a single circuit.
3Productivity
If the number of nozzles is increased to respond to demand for high definition, then the image definition is improved, but it becomes difficult to ensure a sufficient region for releasing heat generated in the driving signal output circuit
Solution Approach 1:
The patent transitions from a single-plane heat dissipation approach to a three-dimensional heat management system. Heat sinks are positioned in vertical spaces above and below the substrate, utilizing the Z-dimension for heat dissipation. This allows sufficient heat release capability without increasing the horizontal footprint area, thus supporting high-definition multi-nozzle configurations.
4Loss of energy
If existing heat dissipation technologies (heat sink and fan) are used, then some heat release is achieved, but the heat dissipation performance is insufficient for the increased heat generation from high nozzle count and high operating frequency
Solution Approach 1:
The patent divides the heat dissipation function into multiple independent heat sinks (first heat sink and second heat sink) positioned at different locations and orientations. Each heat sink serves specific amplifier circuits, providing distributed heat release pathways that collectively handle the total heat load from high nozzle count and high-frequency operation, achieving sufficient heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat dissipation, improving the reliability and longevity of the liquid discharge apparatus by reducing thermal stress on components and maintaining ink discharge accuracy.
Implementation Method 1
a plurality of heat conductive elastic bodies positioned between the substrate and the heat sink
Implementation Method 2
a piezoelectric element provided corresponding to each of a plurality of nozzles for discharging the liquid is provided, a predetermined amount of ink is discharged at a predetermined timing from the corresponding nozzle as the piezoelectric element is driven according to a driving signal
Data Source
AI summary
There are provided a substrate on which a first integrated circuit, a first transistor, a second integrated circuit, and a second transistor are disposed; a heat sink fixed to the substrate; the substrate has a first fixing reference hole and a second fixing reference hole, the heat sink has a first fixing reference pin and a second fixing reference pin which are inserted into the first fixing reference hole and the second fixing reference hole, and the first integrated circuit, the second integrated circuit, the first transistor, and the second transistor are positioned between the first fixing reference hole and the second fixing reference hole.