Header Assembly Shielding for Automotive EMI Leakage
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Solution Overview
Problem
Existing RF coaxial connector assemblies in automotive applications face challenges with EMI leakage through large openings in the chassis panel, requiring time-consuming and difficult assembly of additional shielding plates, and lack a reliable means to ground the connector to the chassis due to non-conductive outer housings.
Innovation Solution
A header assembly with a conductive outer housing, a dielectric body, and a shield member with spring fingers that electrically connect to the casing, providing both grounding and shielding by engaging the casing and forming a direct electrical path, thus eliminating the need for additional shielding plates and simplifying assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a non-conductive outer housing is used for FAKRA connectors, then connector standardization and proper attachment are achieved, but grounding to the chassis becomes difficult and requires separate means
Solution Approach 1:
The patent combines the non-conductive outer housing with a separate conductive shield member that provides grounding. The shield member is integrated into the connector assembly, merging the functions of insulation (outer housing) and grounding (conductive shield) into a single unified structure that maintains FAKRA standardization while enabling chassis grounding.
2Ease of operation
If large openings are provided in the chassis for connector installation, then connector access and positioning are facilitated, but EMI leakage increases
Solution Approach 1:
The patent employs a conductive shield member that acts as a flexible electromagnetic barrier. This shield member can be integrated into the connector assembly and extends to cover the opening in the chassis, providing EMI shielding while allowing the connector to be positioned through the opening. The shield effectively closes the electromagnetic gap without interfering with the physical installation process.
3Object-affected harmful factors
If additional shielding plates are added to close openings and provide EMI shielding, then EMI leakage is reduced, but assembly time and complexity increase
Solution Approach 1:
The patent merges the shielding function with the connector assembly itself by integrating the conductive shield member into the connector structure. This eliminates the need for separate shielding plates that would require additional assembly steps. The shield is positioned and secured as part of the connector installation process, reducing assembly time and complexity while maintaining effective EMI shielding.
Solution Approach 2:
The conductive shield member is pre-integrated into the connector assembly during manufacturing, rather than being installed separately during final assembly. This preliminary integration of the shielding function into the connector structure eliminates the need for additional shielding plate installation steps, thereby reducing assembly time and complexity.
4Reliability
If a separate grounding means is used for non-conductive housings, then grounding is achieved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions (insulation, grounding, shielding) into a single integrated connector assembly structure. The conductive shield member serves multiple purposes: it provides grounding to the chassis, shields against EMI, and is integrated into the non-conductive outer housing. This merging of functions reduces the number of separate components needed and simplifies the overall device complexity.
Solution Approach 2:
The conductive shield member is designed to perform multiple functions simultaneously: it provides an electrical path to ground, acts as an EMI shield, and is mechanically integrated into the connector assembly. This multi-functionality reduces the need for separate grounding means and shielding plates, thereby reducing device complexity while maintaining reliable grounding capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI leakage and provides reliable grounding and shielding, simplifying the assembly process by integrating the shield member into the header assembly, which can be loaded through the opening as a unit, reducing assembly time and parts required.
Implementation Method 1
The spring fingers are configured to electrically connect the outer housing to the casing
Data Source
AI summary
A header assembly includes a center contact, a dielectric body surrounding the center contact and an outer housing holding the center contact and the dielectric body. The outer housing has a rear shell mounted to a circuit board and positioned interior of the casing. The outer housing has an outer contact extending from the rear shell that extends through an opening in the casing with a portion of the outer contact positioned exterior of the casing. The dielectric body is received in the outer contact. A shield member is coupled to the outer housing. The shield member engages the outer contact to electrically connect the shield member to the outer housing. The shield member has spring fingers that engage the casing at the opening. The spring fingers electrically connect the outer housing to the casing.