Implantable Device Header Conductive Pins Vertical Routing
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Solution Overview
Problem
The manufacturing of implantable medical device header structures is challenging due to the difficulty in routing individual conductor wires between laterally spaced bores without creating short circuits, especially when feedthrough conductors enter from one side and electrical connectors are on the opposite side, given the small size and pre-shaped configurations of the components.
Innovation Solution
The implementation of conductive pathways, including conductive pins inserted through holes from one side of the header structure to the other, where lead frame conductors can attach directly to the pins, facilitating a vertical path to electrical connectors, and a header body design with open cavities for easier installation, such as using shoulders to engage corresponding features in the holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individual conductor wires are manually routed from feedthrough conductors to electrical connectors through laterally spaced bores, then electrical interconnection is achieved, but the risk of short circuits between adjacent conductors increases and manufacturing difficulty increases
Solution Approach 1:
The patent transitions from lateral routing of conductors through horizontally spaced bores to vertical routing through a vertically extending bore. This dimensional change allows conductors to pass through the header structure without risk of short circuits between adjacent conductors, as they are separated by the insulative wall of the vertical bore rather than running parallel in close proximity
Solution Approach 2:
The patent divides the header structure into distinct functional zones: a recessed area for receiving the feedthrough conductor assembly, a vertical bore for conductor passage, and an enlarged area for receiving the electrical connector. This segmentation allows each component to be positioned and connected independently, simplifying the manufacturing process and reducing the risk of errors
2Reliability
If lead frame conductors with pre-shaped configurations are used to interconnect feedthroughs to electrical connectors, then electrical interconnection is established, but manual routing becomes awkward or impossible due to pre-shaped bends
Solution Approach 1:
The patent changes the routing path from a complex pre-shaped configuration with bends to a simple vertical path. The vertical bore provides a direct route from the feedthrough conductor at the bottom to the electrical connector at the top, eliminating the need for awkward manual routing of pre-shaped lead frame conductors
3Volume of moving object
If the header structure is made small in size, then the implantable medical device becomes more compact, but successfully routing individual conductor wires without creating short circuits becomes very difficult
Solution Approach 1:
The patent uses vertical space within the compact header structure to route conductors through a vertically extending bore. This allows the header to maintain a small lateral footprint while providing sufficient conductor separation and routing space in the vertical dimension, resolving the conflict between compact size and manufacturability
Data Source
AI summary
Implantable medical devices include header structures with conductive paths from the feedthrough conductors that may be located on one side of the device to electrical connectors that may be located on an opposite side of the device. The conductive paths may include conductive interconnect pins and lead frame conductors. The conductive interconnect pins may be located in holes present in a header body where the conductive interconnect pins are attached to the feedthrough conductors on one end and are attached to the lead frame conductors on the opposite end. The lead frame conductors then extend to the corresponding electrical connectors. The header body may provide cavities on each side to allow for the insertion of stack assemblies that include the electrical connectors and lead frame conductors.