Header Connector Spring Clip Coplanarity Alignment

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Solution Overview

Problem

Surface mount header connectors face challenges in achieving coplanarity of solder tails due to manufacturing tolerances, leading to potential electrical shorting and unreliable connections, especially at tight pitches, which increases costs and affects reliability.

Innovation Solution

A header connector design featuring a housing with spring clips that extend through the circuit board to pull the housing and contacts toward the mounting surface, ensuring coplanarity and secure soldering, along with alignment pins and surface mounting tabs to maintain alignment and stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If surface mount header connectors are used with a large number of contacts, then cost and process advantages are achieved along with reduced footprint, but manufacturing and assembly challenges arise due to difficulty in achieving coplanarity of solder tails

Engineering Contradiction:
Improvefootprint on circuit boardVSAvoidcoplanarity of solder tails
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The spring clips are pre-installed on the header connector body before mounting to the circuit board. These pre-installed clips engage with the circuit board during mounting and automatically apply downward force to pull the solder tails into coplanar alignment with the circuit board surface, eliminating the need for post-assembly adjustments or additional solder paste compensation.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If additional solder paste is used to compensate for tolerance and misalignment, then coplanarity may be improved, but electrical shorting and bridging can occur at tight pitches

Engineering Contradiction:
Improvecoplanarity of solder tailsVSAvoidelectrical shorting and bridging
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The spring clips perform the alignment function before soldering occurs. By pre-establishing coplanarity through mechanical force during the mounting process, the need for additional solder paste is eliminated, thereby preventing bridging and shorting that would otherwise occur with excess paste in tight-pitch applications.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The spring clips act as an intermediary mechanical element between the header connector and the circuit board. They transmit and regulate the downward force needed to achieve coplanarity, replacing the need for uncontrolled solder paste as the mediating substance for alignment.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If additional solder paste is used to achieve coplanarity, then alignment may be improved, but cost increases significantly over large numbers of header connectors

Engineering Contradiction:
Improvecoplanarity of solder tailsVSAvoidcost per header connector
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The spring clips are integrated into the header connector manufacturing process itself, allowing coplanarity to be achieved through a single mechanical action during mounting rather than requiring costly additional solder paste materials and rework operations for each connector.

Inventive Principle:
Principle #10Preliminary action

4Ease of manufacture

If solder tails are non-planar with respect to the circuit board plane, then assembly may be simpler, but connection reliability is negatively affected with weak or no connections

Engineering Contradiction:
Improveassembly simplicityVSAvoidconnection reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The spring clips are installed in advance on the header connector and automatically engage with the circuit board during mounting to pull the solder tails into coplanar alignment. This preliminary mechanical alignment ensures reliable solder connections are formed during the soldering process, eliminating weak or failed connections that would result from non-planar tails.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures reliable and cost-effective coplanarity of contacts, reducing the risk of electrical shorting and enhancing the overall reliability of the connector assembly by using spring clips to preload contacts against the circuit board, thereby ensuring strong mechanical connections.

Implementation Method 1

The spring clip has a spring finger extending through the circuit board to engage a bottom side of the circuit board opposite the mounting surface of the circuit board. The spring clip pulls the housing and header contacts toward the mounting surface.

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS8790133B2Header connector
Publication Date: 2014.07.29 TE CONNECTIVITY SOLUTIONS GMBH
  • US8790133B2 patent drawing
  • US8790133B2 patent drawing
  • US8790133B2 patent drawing

AI summary

A header connector includes a housing configured to be mounted to a mounting surface of the circuit board and header contacts held by the housing. The header contacts have mating portions and mounting portions. The mounting portions are configured to be surface mounted to corresponding pads on the circuit board. A spring clip is coupled to the housing. The spring clip has a spring finger extending through the circuit board to engage a bottom side of the circuit board opposite the mounting surface of the circuit board. The spring clip pulls the housing and header contacts toward the mounting surface.