Electric Component Header Layout for RF Integrity and Thermal Isolation
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Solution Overview
Problem
Current designs for transistor outline headers (TO-headers) used in opto-electronic applications face challenges in assembly complexity and achieving good RF-performance while maintaining thermal isolation and signal integrity.
Innovation Solution
The design features a header with a base and pedestals that support submounts with structured conductor platings, allowing for a ground-signal-ground bond wire configuration and mirror symmetry to simplify assembly and enhance RF-performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two separate RF lines with different metal patterns are used to reach the DML from opposite directions, then the RF performance is improved, but the assembly complexity increases
Solution Approach 1:
The patent applies asymmetry by using mirror symmetry in the conductor plating design. The submounts have conductor platings that are mirror images of each other, allowing them to be mounted in opposite orientations while maintaining identical physical characteristics. This resolves the contradiction by enabling complex RF performance requirements to be met through symmetric design that simplifies manufacturing and assembly.
2Reliability
If the cold side is thermally isolated from the hot side, then thermal feedback is prevented, but heat dissipation becomes more difficult
Solution Approach 1:
The patent applies segmentation by dividing the thermal management system into distinct segments: the hot side of the TEC is thermally connected to the base for heat dissipation, while the cold side is thermally isolated from the base to prevent thermal feedback. This segmentation allows simultaneous achievement of effective heat dissipation from the hot side and thermal isolation for the cold side, resolving the contradiction between thermal isolation and heat dissipation.
3Ease of manufacture
If pedestal submounts are made in one stamping process, then manufacturing is simplified, but RF performance and thermal isolation are compromised
Solution Approach 1:
The patent applies segmentation by separating the pedestal submounts from the base, making them as separate components rather than integrating them in one stamping process. This allows the pedestals to be optimized for both RF performance (through proper conductor plating) and thermal isolation (through gaps between pedestals and base), while still maintaining ease of manufacture through modular assembly.
Solution Approach 2:
The patent introduces an intermediary approach by using separate pedestal submounts that mediate between the base and the submounts. These pedestals provide the necessary electrical connections for RF signals while maintaining thermal isolation through gaps, thus resolving the contradiction between manufacturing simplicity and performance requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design facilitates easier assembly and achieves improved RF-performance by reducing signal degradation and thermal feedback, while maintaining the necessary thermal isolation and signal integrity.
Implementation Method 1
each comprising a feedthrough pin extending through the base and being electrically isolated to the base within the feedthrough
Implementation Method 2
The TEC has a hot and a cold side. The hot side is connected to the header for heat dissipation.
Implementation Method 3
bond wires are used, because of their very low thermal conductivity
Implementation Method 4
Within this gap, a mount with the electronic device can be positioned and fastened to the base
Data Source
AI summary
A header for electronic components is provided. The header has a base with at least two electrical feedthroughs each having a feedthrough pin extending through the base and being electrically isolated to the base within the feedthrough. The further includes at least one pedestal connected to the base and two submounts. Each submount includes a carrier with a structured conductor plating that has at least two conductor traces with one of the conductor traces of each submount being electrically connected to one of the feedthrough pins. The submounts are equally formed but mounted in different orientations.