Semiconductor Package Header With Side-Bent Leads for Heat Sink Contact
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Solution Overview
Problem
Existing semiconductor package headers make it difficult to dispose a heat sink on the lower surface of the eyelet due to leads protruding perpendicular to the lower surface, necessitating holes in the heat sink for lead insertion.
Innovation Solution
A header design with an eyelet and metal base configuration where leads are bent at the second surface and protrude from the side surface, allowing the metal base to be spaced apart from the leads, enabling easy disposition of a heat sink on the lower surface without requiring holes in the heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If leads are configured to protrude perpendicular to the lower surface of the eyelet, then the leads can be easily inserted through the eyelet, but it becomes difficult to dispose a heat sink on the lower surface of the eyelet
Solution Approach 1:
The lead configuration changes from protruding perpendicular to the lower surface to protruding from the side surface of the eyelet. This dimensional change in lead orientation eliminates the conflict with heat sink placement, as leads now extend laterally rather than vertically, allowing the heat sink to be disposed flat on the lower surface without requiring holes.
2Temperature
If a heat sink is disposed on the lower surface of the eyelet with perpendicular leads, then heat dissipation can be achieved, but holes must be provided in the heat sink for lead insertion
Solution Approach 1:
By changing the lead protrusion direction from vertical to lateral (side surface), the heat sink can be disposed as a solid plate without holes, simplifying its structure while maintaining heat dissipation functionality through increased contact area.
Solution Approach 2:
The metal base is integrated with the eyelet structure, and the lead configuration is merged with the side surface protrusion design, allowing the heat sink to be disposed on the lower surface without requiring separate hole structures, thereby combining multiple functions into a unified design.
3Reliability
If leads protrude from the lower surface of the eyelet, then electrical connection is achieved, but the contact area between heat sink and eyelet is reduced
Solution Approach 1:
Leads are configured to protrude from the side surface of the eyelet rather than the lower surface, utilizing a different spatial dimension for electrical connection. This allows the entire lower surface of the eyelet to be available for heat sink contact, maximizing the contact area for thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy placement of a heat sink on the lower surface, improving heat dissipation performance by increasing the contact area and eliminating the need for holes in the heat sink, while maintaining a large device mounting area.
Implementation Method 1
a metal base bonded to the second surface of the eyelet... improving heat dissipation performance by increasing the contact area
Data Source
AI summary
A header for a semiconductor package, includes an eyelet having a first surface, a second surface opposite to the first surface, a side surface, and a through hole penetrating the eyelet from the first surface to the second surface, a lead inserted through the through hole, and a metal base bonded to the second surface of the eyelet. The lead is bent at the second surface of the eyelet and protrudes from the side surface of the eyelet in a plan view. The metal base is spaced apart from the lead. The lead, located at a position overlapping the eyelet in the plan view, is disposed within a thickness range of the metal base in a side view.