Header Component With Top-Loading Cavity for Insulated Inductor Assembly

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Solution Overview

Problem

Existing header components for mounting inductive components on substrates, such as transformers, face challenges in simple and automation-friendly assembly, often compromising insulation and shielding due to lateral openings, and require potting materials that can affect magnetic properties and compliance with regulations.

Innovation Solution

A header component with a housing that confines the inductive component inside a cavity accessible via a top opening, allowing vertical insertion and connection of terminals to the substrate without lateral openings, which enhances insulation, safety distances, and eliminates the need for potting materials, thereby improving assembly efficiency and regulatory compliance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If lateral openings are provided in the housing for inserting the inductive component, then the assembly process is simplified, but the insulation and shielding of the inductive component are compromised

Engineering Contradiction:
Improveassembly processVSAvoidinsulation and shielding
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

Instead of providing lateral openings in the housing for inserting the inductive component, the patent inverts the approach by providing a top opening. The inductive component is inserted from the top side of the housing, with its terminals extending downward to contact the substrate. This inversion eliminates lateral openings that would compromise insulation and shielding, while still enabling simplified assembly through the top opening.

Inventive Principle:
Principle #13The other way round (Inversion)

2Stability of the object's composition

If potting materials are used to secure the inductive component, then the component is firmly fixed, but the magnetic properties and regulatory compliance are affected

Engineering Contradiction:
Improvecomponent fixationVSAvoidmagnetic properties and compliance
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The patent extracts and eliminates the use of potting materials from the assembly. Instead of using potting materials to secure the inductive component, the design relies on the mechanical structure where the component is inserted through a top opening and held in place by the housing geometry and terminal connections to the substrate, thereby maintaining magnetic properties and regulatory compliance.

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of operation

If the top opening is provided at the same side as the terminals, then the insertion is simplified, but the insulation with respect to the substrate is compromised

Engineering Contradiction:
Improveinsertion processVSAvoidinsulation to substrate
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent applies asymmetry by positioning the top opening at the top side of the housing while the terminals extend to the bottom side to contact the substrate. This asymmetric arrangement ensures that the insertion path (through the top opening) is separated from the electrical contact points (terminals at the bottom), thereby maintaining proper insulation between the inductive component and the substrate while still enabling simplified insertion.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentEP4336524A1Header component, inductive device and method for assembling an inductive device
Publication Date: 2024.03.13 WURTH ELECTRONICS MIDCOM INC
  • EP4336524A1 patent drawingFigure 1
  • EP4336524A1 patent drawingFigure 2
  • EP4336524A1 patent drawingFigure 3~4

AI summary

A header component (3) for mounting an inductive component (2) on a substrate comprises a housing (5) for housing the inductive component (2) inside a cavity (6), wherein the housing (5) confines the cavity (6) to a bottom side and to at least three lateral sides, and wherein the housing (5) comprises a top opening (9) to the cavity (6) at a top side opposite to the bottom side, wherein the top opening (9) is configured for inserting the inductive component (2) into the cavity (6) via the top opening (9). The header component (3) further comprises a plurality of terminals (11, 12) for electrically connecting the inductive component (2) to the substrate, wherein the terminals (11, 12) outwardly protrude from the housing (5) at the bottom side. Further disclosed are an inductive device (1) and a method for assembling an inductive device (1).