Vehicle Headlamp Illuminant Micro-Via Layout for Bubble-Free Cooling
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Solution Overview
Problem
Existing motor vehicle headlight illuminants face a compromise between effective cooling and gas discharge due to cavities formed in the solder layer during the soldering process, which reduces the contact surface and impairs cooling efficiency.
Innovation Solution
The use of a two-dimensional hexagonal packing arrangement for micro-vias on the contact elements allows for increased heat conduction while enabling gases to escape through a coherent gas outlet channel system, resulting in a solder layer free of gas bubbles and improved cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If micro-vias are increased to improve cooling efficiency, then heat dissipation is enhanced, but gas discharge capability deteriorates due to reduced space for gas outlet channels
Solution Approach 1:
The contact elements are segmented into multiple hexagonal contact elements arranged in a grid pattern, creating distributed gas outlet channels between them. This segmentation allows gas to escape through multiple pathways while maintaining space for micro-vias within each contact element for heat dissipation.
Solution Approach 2:
Different regions of the circuit carrier are assigned different functions: the contact elements and their immediate surroundings provide gas outlet channels, while the interior regions contain micro-vias for heat dissipation. This local differentiation resolves the conflict between gas discharge and cooling requirements.
2Object-generated harmful factors
If gas outlet channels are increased to improve gas discharge, then cavity formation is reduced, but cooling efficiency deteriorates due to reduced contact surface area
Solution Approach 1:
The solution moves from a two-dimensional trade-off between gas channel area and contact surface area to a three-dimensional configuration where micro-vias extend vertically through the circuit carrier. This allows gas channels to exist in the horizontal plane between contact elements while micro-vias provide vertical heat conduction pathways, eliminating the direct competition for space.
3Reliability
If solder layer area is increased to improve electrical connection, then more contact surface is available, but cavity formation increases due to more gas production during soldering
Solution Approach 1:
The solder connection area is segmented into multiple discrete hexagonal contact elements rather than a single large solder layer. This segmentation reduces the total gas volume produced during soldering while maintaining equivalent electrical connection reliability through distributed contact points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maximizes the number of micro-vias per contact element area, enhancing the cooling of the SMD component and ensuring efficient heat dissipation while maintaining effective gas discharge, thus improving the overall performance of the illuminant.
Implementation Method 1
the circuit carrier has a plurality of micro-vias designed for heat conduction, wherein the heat conduction occurs substantially along a longitudinal extension of the micro-vias
Implementation Method 2
the gas outlet channel system is designed in such a way that gases that escape from the solder layer during the soldering process can escape from a volume formed between the solder layer and the base of the circuit carrier via the gas outlet channel system
Data Source
AI summary
An illuminant (1) for a motor vehicle headlight includes an SMD component (2) and a circuit carrier (4). The SMD component (2) is connected to the circuit carrier (4) by means of a solder connection, wherein the circuit carrier has a plurality of contact elements (5a), wherein in order to dissipate waste heat from the SMD component (2), the circuit carrier (4) has a plurality of micro-vias (7) designed for heat conduction, wherein a number of contact elements (5a) have a substantially hexagonal base (5b), wherein the micro-vias (7) are arranged in a two-dimensional hexagonal packing arrangement with respect to one another in such a way that the substantially hexagonal bases (5b) of the contact elements (5a) are interspersed by a plurality of micro-vias (7) substantially completely, according to the highest area packing density.