Vehicle Headlight Carrier Integrating Micro-LEDs and Sensors
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Solution Overview
Problem
The integration of multiple sensor units and light emitting diodes in motor vehicle headlights results in constructional challenges, including joints and tolerance issues, leading to increased complexity and cost.
Innovation Solution
Integrating micro light emitting diodes and sensor elements, such as cameras, onto a shared carrier element within the vehicle headlight, which can be formed with a curvature to fit seamlessly into the vehicle body, reducing the need for separate mounts and minimizing tolerance problems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple sensor units and light emitting diodes are integrated in separate mounts in the vehicle headlight, then the functionality is enhanced, but constructional complexity and tolerance issues increase
Solution Approach 1:
The patent combines multiple sensor units and light emitting diodes onto a single carrier element, merging previously separate components into one integrated structure. This reduces the number of separate mounts and joints required in the vehicle headlight, thereby reducing constructional complexity while maintaining enhanced functionality through the integrated array of sensors and LEDs
Solution Approach 2:
The carrier element serves multiple functions simultaneously: it acts as a mounting substrate for both sensor units and light emitting diodes, provides structural support, and enables precise positioning of multiple components. This multi-functional design reduces the need for separate mounting structures and simplifies the overall construction of the headlight assembly
2Ease of operation
If multiple separate mounts are used for sensor units and light emitting diodes, then installation flexibility is improved, but tolerance problems and joint requirements increase
Solution Approach 1:
By integrating multiple mounting functions into a single carrier element, the patent eliminates the need for multiple separate mounts and their associated joints. This single integrated structure provides predefined positioning features that ensure precise alignment and reduce tolerance accumulation issues while maintaining installation flexibility through the modular nature of the carrier element design
3Adaptability or versatility
If separate mounting structures are used for sensor units and light emitting diodes, then component independence is maintained, but constructional effort and cost increase
Solution Approach 1:
The patent merges sensor units and light emitting diodes onto a common carrier element that maintains their functional independence through separate mounting areas and electrical connections. This integrated approach reduces constructional effort by eliminating the need for separate mounting structures and reduces cost through simplified assembly processes, while still preserving component independence through the modular carrier design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces constructional effort and complexity, enhances the headlight's functionality, and allows for a more streamlined design of the vehicle, while maintaining effective light output and sensing capabilities.
Implementation Method 1
a plurality of light emitting diodes is arranged, which are individually controllable with respect to a light output
Implementation Method 2
the light emitting diodes comprise a conversion material, which outputs substantially with light upon application with light of a respective light emitting diode
Data Source
AI summary
This disclosure relates to a headlight for a motor vehicle comprising a carrier element, on which a plurality of LEDs are arranged, which can be individually controlled in terms of light output, in order to output light according to a predefinable light distribution by means of the headlight. The LEDs are designed as micro-LEDs and at least one sensor element is arranged in an LED-free region of the carrier element.