Motor Vehicle Headlight SMD Layout for Cooling and Void-Free Soldering
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Solution Overview
Problem
Existing motor vehicle headlight lamps face challenges in achieving effective cooling of SMD components while minimizing the formation of cavities in soldering layers due to gas escape during the soldering process, which compromises the contact area and cooling efficiency.
Innovation Solution
The design incorporates contact elements with essentially hexagonal base areas, arranged in a two-dimensional hexagonal package to maximize micro-vias density for enhanced heat conduction, while a coherent gas outlet channel system allows gases to escape without reducing the contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If micro-vias are increased for heat conduction, then cooling efficiency is improved, but gas escape channels are reduced leading to cavity formation
Solution Approach 1:
The contact area is segmented into multiple contact elements arranged in a grid pattern, where each contact element contains multiple micro-vias. This segmentation allows gas escape channels to be formed between adjacent contact elements while maintaining high micro-via density within each contact element, thus achieving both effective cooling and gas escape.
Solution Approach 2:
Different regions of the circuit carrier are assigned different functions: contact elements contain micro-vias for heat conduction, while the spaces between contact elements form gas escape channels. This local differentiation allows simultaneous optimization of cooling efficiency in contact regions and gas escape in inter-contact regions.
2Reliability
If gas outlet channels are formed to allow gas escape, then cavity formation is reduced, but contact area between solder layer and circuit board is reduced impairing cooling
Solution Approach 1:
The contact area is divided into multiple discrete contact elements with spaces between them. The spaces form gas escape channels while the contact elements maintain thermal contact, thus achieving both gas escape and cooling functions without compromising either.
Solution Approach 2:
The solution moves from a two-dimensional choice (either micro-vias or gas channels) to a three-dimensional arrangement where contact elements are distributed in a grid pattern, creating vertical heat conduction paths through micro-vias while horizontal spaces between elements provide gas escape routes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively improves the soldering connection between components, enhances cooling efficiency by maximizing micro-vias density, and prevents gas bubble formation in the soldering layer, thereby maintaining a robust contact area.
Implementation Method 1
for the heat dissipation of waste heat from the SMD component, the circuit carrier has a plurality of micro-vias configured for heat conduction
Implementation Method 2
the SMD component is connected to the circuit carrier in a thermally conductive and/or electrically conductive manner
Implementation Method 3
the SMD component is connected to the circuit carrier in a thermally conductive and/or electrically conductive manner
Data Source
Figure 1
Figure 2~3
AI summary
Light source (1) for a motor vehicle headlight, comprising an SMD component (2) and a circuit carrier (4), wherein the SMD component (2) is connected to the circuit carrier (4) by means of a soldered connection, wherein the circuit carrier has a plurality of contact elements (5a), wherein, for the purpose of heat dissipation from waste heat of the SMD component (2), the circuit carrier (4) has a plurality of micro-vias (7) designed for heat conduction, wherein a number of contact elements (5a) have a substantially hexagonal base area (5b), wherein the micro-vias (7) are arranged to one another in a two-dimensional hexagonal packing arrangement such that the substantially hexagonal base areas (5b) of the contact elements (5a) are substantially completely penetrated by a plurality of micro-vias (7) according to the highest area packing density.