Headphone Interface Assembly Layout for Easier Housing Assembly

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Solution Overview

Problem

Existing headphone designs face issues with interference between the interface assembly and the housing, leading to assembly difficulties and inconvenience due to fixed connections.

Innovation Solution

The headphone design separates the interface assembly and circuit board, using a wire assembly to connect them, allowing for improved mounting position and posture freedom, which facilitates assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the interface assembly is fixed to the circuit board, then the electrical connection is stable, but the assembly process becomes difficult and interference is generated

Engineering Contradiction:
Improveelectrical connection stabilityVSAvoidassembly convenience
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The interface assembly is separated from the circuit board and positioned independently in the receiving slot, connected only through a wire assembly. This segmentation allows the interface assembly to be installed separately without requiring complex fixed connections to the circuit board, thereby simplifying the assembly process while maintaining electrical connectivity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The wire assembly acts as an intermediary element between the interface assembly and the circuit board. Instead of directly fixing the interface assembly to the circuit board, the wire assembly provides a flexible connection that reduces interference and simplifies the assembly process while maintaining electrical connection stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the interface assembly is fixed to the circuit board, then the electrical connection is stable, but interference is generated between the interface assembly and housing

Engineering Contradiction:
Improveelectrical connection stabilityVSAvoidinterference between interface assembly and housing
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

By segmenting the interface assembly from the circuit board and positioning it independently in the receiving slot, the design reduces the overlapping areas between the interface assembly and the housing. This spatial separation minimizes interference while maintaining electrical connection through the wire assembly.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The wire assembly serves as an intermediary that decouples the interface assembly from direct contact with the housing and circuit board. This intermediary connection reduces electromagnetic interference and physical interference between the interface assembly and surrounding components.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Stability of the object's composition

If the interface assembly is fixed to the circuit board, then the structure is stable, but the adaptability of the housing is reduced

Engineering Contradiction:
Improvestructural stabilityVSAvoidhousing adaptability
Core Design Contradiction:
Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The interface assembly is segmented from the circuit board and positioned independently, allowing the housing to be designed with greater flexibility. The receiving slot can be configured in different positions and orientations without being constrained by fixed mounting requirements, thereby improving housing adaptability while maintaining structural stability through the wire assembly connection.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20250350877A1headphones
Publication Date: 2025.11.13 SHENZHEN SHOKZ CO LTD
  • US20250350877A1 patent drawing
  • US20250350877A1 patent drawing
  • US20250350877A1 patent drawing

AI summary

An headphone is provided. The headphone includes a housing assembly, an interface assembly, and a wire assembly. The housing assembly includes a first housing, the first housing being provided with a receiving slot and an accommodation cavity in communication with the receiving slot; an interface assembly inserted within the receiving slot; a circuit board disposed within the accommodation cavity; and a wire assembly electrically connecting the circuit board and the interface assembly. In the manner disclosed above, a freedom of a mounting position and a mounting posture of the interface assembly may be improved, which facilitates the assembly of the headphone.