Headphone Interface Assembly Layout for Easier Mounting

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Solution Overview

Problem

Existing headphones face issues with interference and assembly difficulties due to the fixed connection of the interface assembly to the circuit board, leading to inconvenience in usage.

Innovation Solution

The headphone design separates the interface assembly and circuit board with a wire assembly for connection, allowing for improved mounting position and posture freedom, which facilitates assembly and reduces interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the interface assembly is fixed to the circuit board, then the connection stability is improved, but the assembly difficulty increases and interference between the interface assembly and housing increases

Engineering Contradiction:
Improveconnection stabilityVSAvoidassembly difficulty
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The interface assembly is separated from the circuit board into an independent component. The interface assembly includes a main body portion and a wire arrangement portion, where the main body portion is inserted into a receiving slot in the housing, and the wire arrangement portion extends into the accommodation cavity to connect to the circuit board. This segmentation allows the interface assembly to be mounted independently on the housing while maintaining electrical connection through wires, thereby reducing assembly difficulty and avoiding interference with the housing structure.

Inventive Principle:
Principle #1Segmentation

2Reliability

If the interface assembly is fixed to the circuit board, then the connection stability is improved, but the interference between the interface assembly and housing increases

Engineering Contradiction:
Improveconnection stabilityVSAvoidinterference
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The interface assembly is extracted from the circuit board and positioned independently within the housing. The main body portion is inserted into the receiving slot, allowing it to be spatially separated from the circuit board located in the accommodation cavity. This extraction eliminates direct contact and interference between the interface assembly and the housing structure while maintaining electrical connectivity through the wire arrangement portion.

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of manufacture

If the interface assembly is separated from the circuit board with a wire assembly, then the assembly ease is improved, but the structural complexity increases

Engineering Contradiction:
Improveassembly easeVSAvoidstructural complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The wire arrangement portion is nested within the accommodation cavity of the housing, and the main body portion is nested within the receiving slot. The wire assembly is routed through predefined pathways within the housing structure, utilizing existing spatial arrangements. This nesting approach allows the separated interface assembly and circuit board to be integrated into the housing without adding significant structural complexity, as the components fit within the existing housing geometry.

Inventive Principle:
Principle #7Nested doll (Nesting)

Data Source

PatentUS20250350876A1headphones
Publication Date: 2025.11.13 SHENZHEN SHOKZ CO LTD
  • US20250350876A1 patent drawing
  • US20250350876A1 patent drawing
  • US20250350876A1 patent drawing

AI summary

An headphone is provided. The headphone includes a housing assembly, an interface assembly, and a wire assembly. The housing assembly includes a first housing, the first housing being provided with a receiving slot and an accommodation cavity in communication with the receiving slot; an interface assembly inserted within the receiving slot; a circuit board disposed within the accommodation cavity; and a wire assembly electrically connecting the circuit board and the interface assembly. In the manner disclosed above, a freedom of a mounting position and a mounting posture of the interface assembly may be improved, which facilitates the assembly of the headphone.