Headphone Interface Assembly With Flexible Wire Connection

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Solution Overview

Problem

Existing headphones face issues with interference and assembly difficulties due to the fixed connection of the interface assembly to the circuit board, leading to inconvenience in assembly and potential mechanical stress.

Innovation Solution

The headphone design separates the interface assembly from the circuit board and uses a wire assembly to connect them, allowing for improved mounting position and posture freedom, which facilitates assembly and reduces mechanical stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the interface assembly is fixed to the circuit board, then the electrical connection is stable, but the assembly process becomes difficult and interference is generated

Engineering Contradiction:
Improveelectrical connection stabilityVSAvoidassembly process
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The interface assembly is separated from the circuit board into an independent component. The interface assembly includes a housing with a receiving slot that can independently receive and secure the connector, while the circuit board remains a separate entity. This segmentation allows each component to be manufactured and assembled independently, eliminating the interference and assembly difficulties caused by fixed connections.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A wire assembly acts as an intermediary element between the interface assembly and the circuit board. Instead of directly fixing the interface assembly to the circuit board, the wire assembly provides a flexible electrical connection that mediates the relationship between these two components, reducing mechanical stress and interference while maintaining electrical connectivity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the interface assembly is fixed to the circuit board, then the electrical connection is stable, but mechanical stress is generated during assembly

Engineering Contradiction:
Improveelectrical connection stabilityVSAvoidmechanical stress
Core Design Contradiction:
ReliabilityVSStress or pressure

Solution Approach 1:

The connection between the interface assembly and circuit board is transformed from a fixed, rigid connection to a dynamic, flexible connection through the wire assembly. The wire assembly can accommodate movement and deformation, reducing mechanical stress during assembly and use while maintaining stable electrical connection.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The wire assembly functions as a flexible connector that replaces rigid fixed connections. This flexible element can bend and deform to accommodate mechanical movements, reducing stress concentration and preventing damage to both the interface assembly and circuit board during assembly and operation.

Inventive Principle:
Principle #30Flexible shells and thin films

3Reliability

If the interface assembly is fixed to the circuit board, then the electrical connection is stable, but the adaptability of the housing is reduced

Engineering Contradiction:
Improveelectrical connection stabilityVSAvoidhousing adaptability
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

By segmenting the interface assembly from the circuit board, the housing of the interface assembly gains independence and adaptability. The interface assembly housing can be designed with its own structural features (receiving slot, support platform) that allow it to adapt to different mounting configurations and external conditions without being constrained by direct fixation to the circuit board.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20250350878A1headphones
Publication Date: 2025.11.13 SHENZHEN SHOKZ CO LTD
  • US20250350878A1 patent drawing
  • US20250350878A1 patent drawing
  • US20250350878A1 patent drawing

AI summary

An headphone is provided. The headphone includes a housing assembly, an interface assembly, and a wire assembly. The housing assembly includes a first housing, the first housing being provided with a receiving slot and an accommodation cavity in communication with the receiving slot; an interface assembly inserted within the receiving slot; a circuit board disposed within the accommodation cavity; and a wire assembly electrically connecting the circuit board and the interface assembly. In the manner disclosed above, a freedom of a mounting position and a mounting posture of the interface assembly may be improved, which facilitates the assembly of the headphone.