Headphone Lead Routing via Sliding Over-Head Passage

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Solution Overview

Problem

Existing headphones face challenges in adjustability and mechanical design due to the vulnerability of electrical leads, which are prone to twisting, bending, and fatigue, especially when accommodating different head shapes and sizes.

Innovation Solution

The design separates mechanical and electrical connections, using a flexible and resilient lead element that slides through a larger opening in the earphone housing, remaining straight and enclosed within the over-the-head passage, reducing the risk of damage and entanglement, and allowing for independent adjustments and pivotal movement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If leads are integrated into mechanical adjustment systems, then electrical connections are provided, but mechanical design becomes challenging due to lead vulnerability

Engineering Contradiction:
Improvelead durabilityVSAvoidmechanical design complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent divides the connection system into separate mechanical and electrical components. The mechanical adjustment system (sliding mechanism) is separated from the electrical lead, allowing independent optimization of each subsystem while reducing overall complexity and improving lead durability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The electrical lead is extracted from the mechanical adjustment system and routed separately through the over-the-head passage. This extraction eliminates the vulnerability of leads integrated into moving mechanical parts while maintaining electrical connectivity.

Inventive Principle:
Principle #2Taking out (Extraction)

2Device complexity

If leads are provided separately, then mechanical design is simplified, but leads are subject to twisting and bending causing fatigue and failure

Engineering Contradiction:
Improvemechanical design complexityVSAvoidlead durability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The lead routing transitions from a two-dimensional planar path (prone to twisting) to a three-dimensional path through the over-the-head passage. This dimensional change allows the lead to remain straight and protected from bending fatigue while maintaining mechanical simplicity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If earphone housings slide on over the head passage, then adjustability is provided, but leads must accommodate motion causing vulnerability

Engineering Contradiction:
ImproveadjustabilityVSAvoidlead durability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The over-the-head passage serves as an intermediary structure that accommodates both the sliding motion of earphone housings and the electrical lead. This mediator allows relative motion between components while protecting the lead from damage.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Reliability

If leads pass into housing integrated in mechanical systems, then electrical connections are provided, but leads are prone to entanglement with user's hair

Engineering Contradiction:
Improvelead durabilityVSAvoiduser comfort
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The lead is extracted from the earphone housing and routed through the over-the-head passage, removing it from the area where it can entangle with user's hair. This extraction improves user comfort while maintaining electrical connectivity.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentEP2892246B1Headphones with over the head passage
Publication Date: 2019.09.25 SENNHEISER COMM
  • EP2892246B1 patent drawingFigure 1
  • EP2892246B1 patent drawingFigure 2
  • EP2892246B1 patent drawingFigure 3

AI summary

A headphone with over the head passage and two earphone housings is provided, with one housing attached at each end of the over the head passage at attachment areas thereof, and an electrical lead element passing between the over the head passage and the earphone housing. The over the head passage is connected at the attachment area to an earphone housing at an earphone attachment site arranged externally of the earphone housing, and the earphone housing comprise a lead element opening spaced from the earphone attachment site. The lead element opening is larger than the electrical lead element and the lead element is slidably arranged in the lead element opening.