Heat Spreader Chimney for VR Headset Thermal Management
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Solution Overview
Problem
Wearable electronic devices, such as virtual reality headsets, face challenges in thermal management due to increased power consumption and heat generation, which can lead to discomfort for users, and integrating active cooling systems is not feasible as they consume power and generate noise.
Innovation Solution
A heat spreader with a chimney is attached to the headset, providing a passive cooling system that can be controlled based on temperature, allowing for flexible deployment to dissipate heat without adding power consumption or noise, and is enclosed in insulating materials to prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active cooling systems (such as fans) are integrated into the headset, then heat dissipation capability is improved, but power consumption increases and noise and vibrations are generated
Solution Approach 1:
The patent replaces the active mechanical cooling system (fan) with a passive thermal management system consisting of a heat spreader and chimney structure. The chimney utilizes natural convection currents to draw hot air away from the processing system without requiring mechanical force, thereby eliminating power consumption and noise associated with active fans while maintaining effective heat dissipation.
Solution Approach 2:
The cooling system is designed to be self-regulating through the chimney structure that automatically draws hot air away from the processing system using natural convection. The system requires no external control or power input, as the temperature difference itself drives the cooling process, allowing the system to self-manage thermal conditions without additional energy expenditure.
2Temperature
If active cooling systems (such as fans) are integrated into the headset, then heat dissipation capability is improved, but noise and vibrations are generated
Solution Approach 1:
The patent eliminates mechanical moving parts by replacing the fan-based cooling system with a passive chimney structure that relies on natural convection. This substitution removes the source of noise and vibrations entirely, as there are no rotating blades or mechanical components to generate unwanted disturbances during operation.
3Adaptability or versatility
If processing capabilities are increased in electronic headsets, then device functionality is improved, but heat generation increases
Solution Approach 1:
The patent extracts the heat management function from the main headset body by implementing a separate chimney structure that extends from the heat spreader. This dedicated thermal management component is specifically designed to capture and remove heat generated by the processing system, allowing the processing capabilities to be increased without proportionally increasing the thermal burden on the user-contact portions of the headset.
Solution Approach 2:
The chimney structure extends the heat dissipation pathway in the vertical dimension, drawing hot air upward and away from the headset body. This three-dimensional approach to thermal management allows heat to be removed from the processing system without requiring additional lateral space or compromising the compact form factor of the headset, thereby enabling higher processing power within the same physical envelope.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages thermal performance of wearable devices, enhancing user comfort by maintaining safe skin temperatures without compromising power efficiency or user experience.
Implementation Method 1
The chimney includes an air gap and provides a passive cooling system
Implementation Method 2
The heat spreader is designed to dissipate heat generated by the processing system
Implementation Method 3
enclosed in insulating materials to prevent overheating
Data Source
Figure 1A
Figure 1B
Figure 2A
AI summary
Systems and methods relate to thermal management of electronic headsets, such as virtual reality headsets. An electronic headset includes a body which can hold a processing system. A heat spreader is attached to the body, wherein the heat spreader includes a chimney. The chimney is designed to dissipate heat generated by the processing system. The heat spreader can be controlled to extend the chimney based on the heat perceived on external surfaces of the electronic headset which can come in contact with a user's skin. The chimney includes an air gap and provides a passive cooling system.