Headset Microphone Mounting Structure for Noise Exclusion
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Solution Overview
Problem
Existing microphone mounting structures for headsets, particularly TWS products, face challenges in simplicity of installation, effectiveness in excluding exterior noises, and lack of water resistance and durability.
Innovation Solution
A microphone mounting structure for a headset that includes a housing forming an audio output channel with a microphone positioned vertically inside, a substrate with a supporting part, and a circuit substrate with multiple small holes for water resistance, along with upper and lower plates for reinforcement and easy mounting, allowing for improved sound quality and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If a microphone is mounted in a closed space away from the audio output channel to avoid interference, then speaker audio interference is reduced, but the installation structure becomes too complicated
Solution Approach 1:
The patent merges the microphone mounting structure with the speaker driver assembly by mounting the microphone on the audio output surface of the speaker driver. This integration allows the microphone to be positioned in a space that is both away from the audio output channel (to avoid interference) and easily installable (simplifying the structure). The substrate with supporting part provides a unified mounting platform that combines both functions.
2Ease of manufacture
If a microphone is mounted in a simple structure, then ease of manufacture is improved, but water resistance and durability are insufficient
Solution Approach 1:
The patent uses a substrate with a supporting part that provides both structural support and water resistance. The substrate acts as a protective barrier between the microphone and the external environment, ensuring water resistance while maintaining simple mounting. The flexible nature of the substrate allows it to conform to the audio output surface while providing durable protection.
3Ease of manufacture
If a single large hole is used in the circuit substrate, then manufacturing is easier, but water resistance is compromised
Solution Approach 1:
The patent segments the single large hole into multiple smaller holes in the circuit substrate. This segmentation maintains ease of manufacture while significantly improving water resistance. The multiple small holes reduce the total opening area, making it more difficult for water to penetrate through, while still allowing sufficient acoustic passage for the microphone to function properly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables easy and effective microphone mounting with enhanced water resistance and durability, improving sound quality by positioning the microphone within the audio output channel and using multiple small holes to prevent water ingress, while maintaining simplicity in manufacturing and noise exclusion.
Implementation Method 1
When currents flow through a coil, the magnet becomes an electromagnet having its own magnetic field. Interacting with peripheral magnetic fields, the electromagnet generates forces of attraction and repulsion, thereby alternatively pulling or pushing the sound wave, vibrating a diaphragm, and producing sound wave.
Implementation Method 2
When currents flow through a coil, the magnet becomes an electromagnet having its own magnetic field. Interacting with peripheral magnetic fields, the electromagnet generates forces of attraction and repulsion, thereby alternatively pulling or pushing the sound wave, vibrating a diaphragm, and producing sound wave.
Data Source
AI summary
The present invention provides a microphone mounting structure for a headset, the microphone mounting structure comprising: a housing surrounding the headset and forming an audio output channel along a vertical direction inside; a microphone mounted along the vertical direction inside a space formed by the audio output channel, and a substrate connected to a main board and including a supporting part mounted in a rear side of the microphone, wherein the microphone includes a circuit substrate formed in a rear side of the microphone, and the circuit substrate includes a hole, wherein the supporting part includes a substrate hole communicating the hole.