Wireless Headset PCB Layout for Compact Touch and Battery Integration
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Solution Overview
Problem
Existing wireless headsets face issues with increased size and weight due to the inclusion of components like a feed-back microphone, loudspeaker, battery, and pressure sensitive components, leading to discomfort and poor signal control, with limited space utilization and battery capacity.
Innovation Solution
A wireless headset design with a housing featuring separate chambers for circuit boards, allowing for a first circuit board in the head portion and a second circuit board in the rod portion, along with a parallel arrangement of loudspeaker and battery, and a pressure sensitive component between a relief portion and the housing, enhancing space utilization and reducing stacking compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the stack architecture is used to make full use of limited space, then space utilization is improved, but the headset size and weight increase leading to discomfort
Solution Approach 1:
The patent divides the headset into distinct functional modules: head portion housing, rod portion housing, and earbud housing. Each module contains specific components (circuit boards, battery, loudspeaker, microphone) arranged in separate chambers, allowing optimized space utilization without excessive weight accumulation in any single location.
Solution Approach 2:
The patent transitions from a single-layer stacked architecture to a multi-chamber three-dimensional distribution system. Components are arranged across multiple spatial dimensions (head portion, rod portion, earbud) with vertical stacking within each chamber, maximizing space efficiency while controlling weight distribution for comfort.
2Volume of moving object
If pressure sensitive components are placed in limited space, then device compactness is improved, but unintentional touch occurs making signal capture difficult
Solution Approach 1:
The pressure sensitive component is isolated in a dedicated chamber within the rod portion housing, separated from other components and external environments. This segmentation provides a controlled testing environment that prevents unintentional touches while maintaining compact integration.
Solution Approach 2:
The patent introduces an adapter circuit board as an intermediary between the pressure sensitive component and the mainboard. This intermediary layer processes and validates pressure signals before transmission, filtering out false triggers while maintaining the compact pressure sensitive region.
3Adaptability or versatility
If multiple components are disposed in the head portion through an adapter circuit board, then functional integration is improved, but the structure becomes complex and space-constrained
Solution Approach 1:
The patent segments the circuit board system into a mainboard in the head portion and a separate adapter circuit board in the rod portion. This segmentation distributes functional integration across multiple modules, reducing the complexity burden on any single circuit board while maintaining overall system versatility.
Solution Approach 2:
The patent moves the adapter circuit board from a planar extension of the mainboard to a separate three-dimensional module in the rod portion. This spatial separation allows independent optimization of each circuit board's layout and reduces structural complexity while maintaining functional integration through wireless or wired connection.
Data Source
Figure 1
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AI summary
Provided are a wireless headset, an assembly method, an electronic device and a storage medium. The wireless headset includes a housing (10), a mainboard (20) and a pressure sensitive component (40). The housing (10) includes: a first chamber (101) defined in a head portion of the wireless headset, and a second chamber (102) defined in a rod portion of the wireless headset and in communication with the first chamber (101). The mainboard (20) includes: a first circuit board (21) disposed in the first chamber (101), a second circuit board (22) disposed in the second chamber (102) and provided with a relief portion, and an adapter circuit board (23) disposed in the housing (10) and configured to connect the first circuit board (21) with the second circuit board (22). The pressure sensitive component (40) is disposed in the second chamber (102) and between the relief portion and the housing (10).