Head-worn Device Thermal Architecture Heat Transfer

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Solution Overview

Problem

Existing head-worn artificial reality devices struggle to efficiently dissipate byproduct heat, leading to discomfort for the user and potential harm to electronic components. Traditional passive cooling systems concentrate heat, creating hot spots, while active cooling systems like fans are impractical due to size and noise issues.

Innovation Solution

The proposed thermal architecture for a head-worn device includes a lens frame, temple arms, and a heat-transfer component. The heat-transfer component is configured to transfer byproduct heat from electrical components within the lens frame to the temple arms, effectively distributing heat away from skin contact areas. This design allows for extended operation at optimal performance by managing thermal loads.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If traditional passive cooling systems are used, then device structure is simple, but heat is concentrated in specific locations creating uncomfortable hot spots for the wearer

Engineering Contradiction:

Improvecooling system structureVSAvoidheat concentration on skin

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The cooling system divides the heat dissipation function into multiple segments: electrical components generate heat, heat transfer components conduct heat away, and temple arms dissipate heat to the environment. This segmentation allows heat to be distributed across multiple locations rather than concentrated in one spot, resolving the contradiction between simple structure and heat concentration issues.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Heat transfer components act as intermediaries between the electrical components and the temple arms, conducting heat away from the skin-contact areas and transferring it to the temple arms which then dissipate heat to the environment. This intermediary mechanism prevents direct heat concentration on the wearer's skin while maintaining structural simplicity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If traditional active cooling systems like fans are used, then heat dissipation efficiency is improved, but device size increases and noise is produced interfering with user immersion

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddevice size and noise

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical fan-based active cooling system with a passive thermal conduction system using heat transfer components and temple arms. This substitution eliminates the need for moving parts, reducing device size and eliminating noise while maintaining effective heat dissipation through thermal conduction and convection to the environment.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Power

If electrical components operate at high thermal design power, then computational performance is improved, but heat generation increases causing discomfort and potential harm to components

Engineering Contradiction:

Improvecomputational performanceVSAvoidheat generation

Core Design Contradiction:

PowerVSObject-affected harmful factors

Solution Approach 1:

The system converts the harmful heat generated by high-power electrical components into a manageable thermal flow by implementing heat transfer components that conduct heat away from sensitive areas and temple arms that dissipate it to the environment. This allows the electrical components to operate at high power for improved computational performance while the heat is systematically managed and dissipated without causing discomfort or damage.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This thermal architecture enhances user comfort by reducing heat concentration on the skin and prolongs the operational duration of the device's electrical components by effectively managing thermal design power (TDP).

Implementation Method 1

The heat-transfer component is configured to transfer the byproduct heat from the one or more electrical components to the first temple arm

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250155732A1Thermal architecture designs for a head-worn device, and systems and methods of use thereof

Publication Date: 2025.05.15 META PLATFORMS TECHNOLOGIES LLC

AI summary

A head-worn device that includes a lens frame, a first temple arm, one or more electrical components, and a heat-transfer component. The lens frame is configured to hold at least two lenses in place. The first temple arm is coupled to the lens frame via a hinge. The one or more electrical components are located within the lens frame, and the one or more electrical components emit heat when operating. The heat-transfer component is configured to transfer the heat from the one or more electrical components to the first temple arm, and the transferring the heat from the one or more electrical components to the first temple arm is configured to cause a lengthening of a time duration during which the one or more electrical components can operate at their respective thermal design power (TDP).