Head-Worn Thermal Management Structure for Heat Conduction Away From Skin

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Solution Overview

Problem

Current thermal management systems for head-mounted augmented reality systems face challenges in efficiently conducting heat away from the user's head, particularly due to the low thermal conductivity of composite materials used in wearable components, which can lead to discomfort and reduced operational efficiency.

Innovation Solution

A thermal management structure is introduced that utilizes a laminate composite structure with alternating layers of high and low thermal conductivity materials, along with strategically placed thermal vias to optimize heat transfer away from the head, eliminating the need for air vents and fans by relying on conduction rather than convection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If composite materials are used in wearable components, then the wearable component achieves structural integrity and form factor, but thermal conductivity is reduced leading to heat buildup

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidthermal management structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The wearable component is divided into multiple layers with different thermal conductivity characteristics. The housing includes a first portion with lower thermal conductivity and a second portion with higher thermal conductivity, creating segmented thermal zones that efficiently manage heat without requiring complex active cooling systems.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs composite material construction with portions of the housing made from different materials having distinct thermal conductivity properties. This composite approach allows the structure to simultaneously achieve mechanical integrity and optimized thermal management pathways.

Inventive Principle:

Principle #40Composite materials

2Temperature

If thermal management structure is added to conduct heat away, then heat transfer improves, but device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improveheat dissipationVSAvoidmanufacturing complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The thermal management functionality is merged into the housing structure itself rather than being a separate component. The differentiated thermal portions are integrated directly into the housing design, eliminating the need for additional thermal management components and simplifying manufacturing processes.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The housing serves multiple functions: it provides structural support, defines the device form factor, and simultaneously acts as the thermal management system through its differentiated thermal conductivity portions. This multi-functionality reduces overall device complexity and manufacturing steps.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If heat is not effectively managed, then electronic component lifespan is reduced, but adding thermal management increases device complexity

Engineering Contradiction:

Improveelectronic component lifespanVSAvoidthermal management system complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The housing structure automatically performs thermal management functions through its inherent material properties and geometric design. The differentiated thermal portions passively conduct heat away from electronic components without requiring external power or control systems, achieving reliability enhancement through self-service thermal management.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively directs heat away from the user's head, improving comfort and extending the operational lifespan of electronic components by enhancing thermal conductivity and reducing heat buildup.

Implementation Method 1

a thermal management structure in thermal communication with the electronic component, the thermal management structure being configured to transfer heat from the electronic component away from a user side of the wearable component

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentEP3933547B1Thermal management systems for wearable components

Publication Date: 2023.12.27 MAGIC LEAP INC

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AI summary

In various embodiments, a wearable component configured to be worn on a head of a user is disclosed. The wearable component can comprise a wearable support and an electronic component coupled to or disposed within the wearable support. A thermal management structure can be provided in thermal communication with the electronic component. The thermal management structure can be configured to transfer heat from the electronic component away from the head of the user when the wearable support is disposed on the head of the user.