Healable Polyimide Resin via Dynamic Covalent Bonds
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Solution Overview
Problem
Conventional thermosetting resin polymers are not repairable and pose environmental pollution issues due to poor heat and chemical resistance, limiting their recyclability and healability.
Innovation Solution
A healable and recyclable polyimide polymer resin is developed, incorporating a specific chemical structural unit that bonds with condensation-polymerizable monomers, enabling healing and recycling through temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If conventional thermosetting resin polymer is used, then rigidity and structural stability are achieved, but the material cannot be repaired or recycled and causes environmental pollution
Solution Approach 1:
The patent introduces dynamic covalent bonds (disulfide bonds, imine bonds, or hydrazone bonds) that can reversibly change their bonding state in response to temperature changes. At service temperature, these bonds provide structural stability; at healing temperature, they break and reform to enable repair. This parameter change approach allows the material to transition between stable and healable states.
Solution Approach 2:
The patent creates composite polyimide structures combining traditional stable polyimide backbones with dynamic covalent bond networks. The resulting material integrates both the rigidity and chemical resistance of conventional thermosetting resins with the healability of reversible bonding systems, achieving a multi-functional composite material.
2Ease of manufacture
If conventional thermosetting resin polymer is used, then structural rigidity is maintained, but recyclability is lost and environmental pollution increases
Solution Approach 1:
The patent transforms the static, irreversible crosslinked structure of conventional thermosetting resins into a dynamic network with reversible bonds. These bonds remain intact under normal conditions to maintain rigidity but can break and reform during recycling processes, enabling the material to be reprocessed and reused while maintaining its structural properties.
Solution Approach 2:
The patent utilizes temperature-induced phase transitions to control the bonding state. The dynamic covalent bonds remain stable at service temperatures but undergo bond breaking at elevated temperatures during recycling, then re-form upon cooling. This phase transition mechanism enables recyclability without compromising the material's rigidity during normal use.
3Ease of repair
If healable polyimide resin is developed, then repairability is achieved, but heat-resistibility and chemical-resistibility deteriorate
Solution Approach 1:
The patent introduces dynamic covalent bonds at specific locations within the polyimide structure where healing is needed, while the bulk polyimide matrix maintains its heat-resistant and chemically resistant properties. The dynamic bonds are strategically placed to enable healing without compromising the overall thermal and chemical stability of the material system.
Solution Approach 2:
The patent designs dynamic covalent bonds with specific activation temperatures that are higher than normal service temperatures but lower than the degradation temperature of the polyimide matrix. This parameter selection ensures that the bonds remain stable during normal use (maintaining heat resistance) but can be activated for healing when intentionally heated to controlled temperatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polyimide polymer resin exhibits enhanced rigidity, chemical resistance, heat resistance, healability, and recyclability, with a coefficient of thermal expansion of 10 ppm/°C to 70 ppm/°C and a glass transition temperature of 170°C to 380°C, facilitating environmental sustainability and reducing waste.
Implementation Method 1
which can be healed and recycled by a method of controlling temperature
Implementation Method 2
In the dissolving process, the healable and recyclable polyimide polymer resin is dissolved in a solution of diethylenetriamine
Implementation Method 3
In the film-forming process, the recycled polyimide solution is coated and baked, so as to form a recycled polyimide film
Data Source
AI summary
A healable and recyclable polyimide polymer resin includes a chemical structural unit represented by formula (I), which is defined in the description. The chemical structural unit represented by the formula (I) bonds to at least one condensation-polymerizable monomer, so as to form the healable and recyclable polyimide polymer resin, and the condensation-polymerizable monomer is a diamine monomer or a dianhydride monomer.