IC Chip Hearing Aid Module for Mobile Terminals

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Solution Overview

Problem

Existing hearing aid modules in mobile communication terminals are bulky and inconvenient for use, especially when integrated into ear microphones, which are becoming more popular, and struggle to provide effective sound amplification for hard-of-hearing individuals.

Innovation Solution

An IC chip type hearing aid module with a hearing aid circuit that includes series connections of resistors and inductors, capacitors, and noise removal sections, along with a gain adjusting section using switches and amplifiers, to adjust impedance and amplify audio signals based on the user's degree of hearing loss, allowing for improved sound output.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the coil is made thicker and the number of turns is increased to increase impedance for hearing aid function, then hearing performance is improved, but the size of the ear speaker becomes larger and less convenient to use

Engineering Contradiction:
Improvehearing aid functionVSAvoidear speaker size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The patent divides the hearing aid function into a separate module that can be independently integrated. The hearing aid coil is separated from the main speaker structure and implemented as a distinct component that can be added to existing speaker designs without significantly increasing overall size. This modular approach allows the hearing aid function to be added while maintaining compact dimensions suitable for mobile terminals.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The hearing aid coil is nested within or alongside the existing speaker structure. The patent shows the hearing aid coil being positioned in close proximity to the speaker coil, utilizing the same magnetic field space. This nested arrangement allows both functions to coexist in a compact volume, with the hearing aid coil benefiting from the magnetic field generated by the speaker coil without requiring a completely separate magnetic circuit.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If a large-sized ear speaker is used to provide hearing aid function, then impedance is increased for better hearing, but convenience of use is reduced

Engineering Contradiction:
Improvehearing aid functionVSAvoidconvenience of use
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent designs the hearing aid module to serve multiple functions: it provides hearing aid functionality through the T-coil while simultaneously maintaining compatibility with the existing speaker system. The module can be integrated into various speaker designs without requiring complete redesign, making it universally applicable across different mobile terminal models and speaker configurations.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent implements switchable or adjustable hearing aid modes that can be dynamically activated or deactivated based on user needs. The hearing aid function can be turned on or off, and the impedance can be adjusted to match different hearing requirements, providing dynamic adaptability that enhances ease of use while maintaining hearing aid effectiveness.

Inventive Principle:
Principle #15Dynamics

3Reliability

If the number of turns of the coil is increased to increase impedance, then hearing aid performance is improved, but the ear speaker becomes thicker

Engineering Contradiction:
Improvehearing aid functionVSAvoidear speaker thickness
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent applies different winding densities and coil configurations to different regions of the hearing aid coil. Instead of uniformly increasing the number of turns throughout the entire coil, the design uses localized variations in turn density and coil geometry to achieve the required impedance in specific areas while maintaining overall compactness. This allows optimization of hearing aid performance without proportionally increasing thickness.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent transitions from a planar coil configuration to a three-dimensional coil structure. By winding the coil in multiple layers and utilizing vertical space more efficiently, the design achieves higher impedance without proportionally increasing the horizontal footprint or overall thickness. The coil is arranged to maximize use of available volume in the z-dimension while maintaining a compact external profile.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The IC chip type hearing aid module enhances sound amplification for hard-of-hearing users by increasing magnetic intensity and adjusting gain settings, providing better audio perception and ease of integration into mobile communication terminals, including ear microphones.

Implementation Method 1

a first section having a resistor and an inductor which are connected in series on a first output line between the mobile communication terminal and an ear speaker

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

a gain adjusting section using switches and amplifiers, to adjust impedance and amplify audio signals

Methodology Applied
Scientific EffectElectromagnetic amplification: Magnetic Amplifier

Implementation Method 3

current flows through the voice coil 13. The current generates a dynamic magnetic field, thereby generating a Lorentz force

Methodology Applied
Scientific EffectLorentz force: Lorentz Force

Data Source

PatentUS7657046B2IC chip type hearing aid module for mobile communication terminal
Publication Date: 2010.02.02 PANTECH CORP
  • US7657046B2 patent drawing
  • US7657046B2 patent drawing
  • US7657046B2 patent drawing

AI summary

Disclosed is an IC chip type hearing aid module for use in a mobile communication terminal having a hearing aid circuit including: a first section having a resistor R1 and an inductor L1 which are connected in series on a first output line Receiver_P between the mobile communication terminal and an ear speaker; a second section having a resistor R4 and an inductor L2 which are connected in series on a second output line Receiver_N between the mobile communication terminal and the ear speaker; a third section having a resistor R2 and a capacitor C2 which are connected in series between an input terminal of the first section and an output terminal of the second section; and a fourth section having a resistor R3 and a capacitor C3 which are connected in series between an input terminal of the second section and an output terminal of the first section.