Solderless Hearing Aid Connector via LDS and Compression
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Solution Overview
Problem
The existing assembly methods for hearing assistance devices, such as hearing aids, are time-consuming and messy due to hand soldering and require complex wire connections, which lead to increased labor, material costs, and potential component damage.
Innovation Solution
The use of laser-direct structuring (LDS) technology for molded interconnect devices (MIDs) combined with flexible universal circuit modules (UCMs) featuring conductive surface traces and elastomeric backing, allowing for solderless connections through direct compression without wires or solder, enabling efficient assembly and repair of hearing aid components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hand soldering and wire connections are used for assembling hearing assistance devices, then electrical connections can be established between components, but the assembly process becomes time-consuming and messy with increased labor costs
Solution Approach 1:
The patent removes the soldering process and wire connections from the assembly method. Instead of using traditional soldered wire interconnects, the invention uses a molded interconnect device (MID) with integrated conductive traces that are pre-formed during molding, eliminating the need for subsequent soldering operations and significantly reducing assembly time and complexity
Solution Approach 2:
The patent combines the electrical connection function with the structural housing into a single integrated component. The MID serves both as part of the device housing and as the electrical interconnect, merging what were previously separate functions (structural support and electrical connection) into one unified element, thereby simplifying assembly
2Reliability
If traditional soldering processes are used, then durable electrical connections are achieved, but material costs and potential component damage increase
Solution Approach 1:
The patent replaces the thermal-mechanical soldering process with a purely mechanical compression connection system. The MID makes direct compressive contact with connection surfaces on modules, establishing electrical connections through mechanical pressure alone without requiring solder material or exposing components to soldering heat, thereby reducing material costs and component damage risk
3Reliability
If complex wire connections are used for module interconnects, then electrical pathways can be established, but device complexity and assembly time increase
Solution Approach 1:
The patent integrates the electrical interconnect function directly into the molded housing structure. The MID contains conductive traces that are formed as an integral part of the housing during the molding process, eliminating the need for separate wire connections and reducing both device complexity and assembly steps
Solution Approach 2:
The electrical connection pathways are pre-formed during the molding process itself. The conductive traces are created and positioned within the MID structure before final assembly, so that when modules are installed, the electrical connections are already in place and simply require compression to activate, eliminating the need for on-site wiring or connection establishment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces assembly time, eliminates the need for soldering, and allows for more efficient design and repair of hearing aids, decreasing material costs and increasing component yield while enabling easier replacement of parts.
Implementation Method 1
laser-direct structuring (LDS) technology for molded interconnect devices (MIDs)
Implementation Method 2
the flex circuit includes a pressure sensitive adhesive to adhere the flex circuit to the UCM
Implementation Method 3
electrically connecting the UCM to the LDS portion using direct compression without the use of wires or solder
Data Source
Figure 1
Figure 2A~3A
Figure 3B~3C
AI summary
Disclosed herein are systems and methods for solderless module connectors for hearing assistance devices. One aspect of the present subject matter includes a method of assembling a hearing assistance device. The method includes providing a structure (300) including a laser-direct structuring (LDS) portion (302, 306), and inserting a flexible universal circuit module (UCM, 200) having conductive surface traces and elastomeric backing (204) into the structure (300). The UCM (200) is electrically connected to the LDS portion (302, 306) using direct compression without the use of wires or solder.