Heat Absorbing Composition for Thermal Management in Electronic Devices
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Solution Overview
Problem
Consumer electronic devices face discomfort due to high palm rest temperatures caused by heat generated from semiconductor packages, despite existing thermal management strategies, as manufacturers continue to shrink chip size and increase capacity, leading to elevated operating temperatures.
Innovation Solution
A heat absorbing and/or thermally insulative composition is applied to a conductive substrate, comprising a matrix with heat absorbing and insulative elements, including phase change materials and thermally conductive fillers, to dissipate heat and reduce skin temperature, integrated with venting elements for efficient heat dispersal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sink and fan are used to dissipate heat from semiconductor packages, then heat dissipation performance is improved, but palm rest temperature increases causing user discomfort
Solution Approach 1:
A thermal barrier layer comprising a heat absorbing composition is introduced as an intermediary between the heat-generating semiconductor packages and the palm rest. This layer absorbs excess heat and prevents it from reaching the palm rest, thereby maintaining both effective heat dissipation and comfortable touch temperature.
Solution Approach 2:
The thermal barrier layer uses a composite material system consisting of a polymer matrix combined with heat-absorbing fillers (such as phase change materials, metal oxides, or ceramic particles). This composite structure provides both thermal management functionality and structural integrity for the barrier layer.
2Productivity
If semiconductor packages are shrunk in size and capacity increased, then device performance is improved, but operating temperature increases
Solution Approach 1:
The thermal barrier layer is selectively positioned in regions where heat accumulation most adversely affects performance and user comfort, such as between semiconductor packages and the palm rest. This localized thermal management allows high-performance components to operate at elevated temperatures without compromising user experience.
3Temperature
If natural graphite heat spreaders are used to distribute heat, then thermal insulation through material thickness is improved, but device complexity increases
Solution Approach 1:
The heat absorbing composition incorporates porous filler materials or creates a porous structure within the polymer matrix. This porous structure provides thermal management functionality while maintaining material flexibility and reducing the need for additional complex thermal management components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition significantly reduces skin temperatures by absorbing and dissipating heat effectively, providing a comfortable user experience while maintaining device performance, even in compact designs.
Implementation Method 1
including phase change materials and thermally conductive fillers
Implementation Method 2
thermally conductive fillers
Implementation Method 3
thermally insulative composition
Data Source
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AI summary
Provided herein is a heat absorbing and/or thermally insulating composition. The heat absorbing and/or insulating composition may be dispensed onto a substrate or between two substrates. The substrate(s) may serve as a support or a heat spreader, in which case the support may be constructed from a conductive material which is a metal or a metal-coated polymeric substrate, or graphite.