Heat Absorbing Layer for Flexible Display Bonding
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Solution Overview
Problem
Existing display devices face challenges in achieving reliable bonding between flexible display panels and circuit boards, particularly due to thermal expansion issues during the curing process of conductive adhesives, which can lead to bonding failures.
Innovation Solution
Incorporating a heat absorbing layer between the base layer and pad areas on the display panel, which absorbs near-infrared laser beams and transfers heat to the conductive adhesive, preventing the circuit board from overheating and maintaining the integrity of bump electrode positions, thereby enhancing bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a flexible display panel is used to thin the display device, then the display device can be made thinner, but bonding reliability between the display panel and circuit board deteriorates due to thermal expansion during adhesive curing
Solution Approach 1:
A heat absorbing layer is introduced as an intermediary component between the display panel base layer and the circuit board. This layer absorbs thermal energy during adhesive curing, preventing thermal expansion of the circuit board and maintaining bonding reliability while enabling thin display device construction
Solution Approach 2:
The heat absorbing layer changes the thermal parameters of the bonding interface by absorbing heat during curing. This parameter change prevents excessive temperature rise and thermal expansion in the circuit board, ensuring stable bonding while maintaining the thin profile of the display device
2Reliability
If conductive adhesive is used to connect display panel and circuit board, then electrical connection is achieved, but thermal expansion during curing causes bonding failure
Solution Approach 1:
The heat absorbing layer serves as a thermal mediator between the conductive adhesive and the circuit board. It absorbs heat during curing, preventing thermal expansion that would otherwise displace bump electrodes and compromise electrical connection precision
Solution Approach 2:
The heat absorbing layer converts the harmful thermal energy generated during adhesive curing into a beneficial effect by absorbing it. This prevents thermal expansion and maintains bump electrode position accuracy, ensuring reliable electrical connections
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of a heat absorbing layer improves the bonding reliability between the display panel and the circuit board by preventing thermal expansion of the circuit board, ensuring consistent electrical connections and device performance.
Implementation Method 1
the heat absorbing layer absorbs near-infrared laser beams and transfers heat to the conductive adhesive
Implementation Method 2
transfers heat to the conductive adhesive
Implementation Method 3
preventing the circuit board from overheating and maintaining the integrity of bump electrode positions
Data Source
AI summary
A display device includes a display panel, a circuit board disposed on the display panel and including a plurality of bump electrodes, and a conductive adhesive member that electrically connects the display panel and the circuit board. The display panel includes a base layer, a plurality of pads arranged on the base layer and spaced apart from each other in a first direction, and a heat absorbing layer disposed between the base layer and the pads, and the heat absorbing layer overlaps the pads in a plan view.