Heat Cost Allocator PCB Layout for Accurate Room Air Sensing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing heat cost allocators face challenges in accurately measuring radiator and room air temperatures due to thermal coupling and positioning issues, particularly in low-temperature heating systems, which affect the accuracy of heat emission calculations.
Innovation Solution
The heat cost allocator design features a main printed circuit board arranged longitudinally in the housing with a sensor printed circuit board positioned perpendicularly, optimizing thermal decoupling by placing the room air temperature sensor far from the radiator and radiator temperature sensor, using a thermally insulating element and heat conduction means for improved thermal coupling with room air, and employing a central main circuit board for reduced heat transfer and space for data transmission components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the room air temperature sensor is positioned close to the radiator for easy installation, then installation is simplified, but thermal coupling with the radiator occurs causing measurement inaccuracy
Solution Approach 1:
The sensor circuit board is arranged perpendicular to the main circuit board, positioning the room air temperature sensor in a spatial dimension that maximizes distance from the radiator while maintaining compact device dimensions. This orthogonal arrangement allows the sensor to be located at the front part of the housing, far from the radiator at the rear, thereby eliminating thermal coupling issues while keeping the device installation-friendly.
2Measurement precision
If the sensors are positioned optimally for accurate measurement, then measurement precision improves, but device complexity increases
Solution Approach 1:
The device is segmented into two functional circuit boards with distinct orientations: the main circuit board arranged longitudinally for compact integration, and the sensor circuit board arranged perpendicular to it for optimal sensor positioning. This segmentation allows each board to be optimized independently - the main board for space efficiency and the sensor board for measurement accuracy - while reducing mutual interference and simplifying the overall design.
3Measurement precision
If thermal decoupling is optimized by positioning sensors far apart, then measurement accuracy improves, but production costs increase
Solution Approach 1:
By arranging the sensor circuit board perpendicular to the main circuit board, the design achieves maximum spatial separation between the room air temperature sensor and the radiator in a compact device footprint. This orthogonal three-dimensional arrangement enables optimal thermal decoupling without requiring additional components or complex assembly processes, thereby maintaining cost-effectiveness while achieving high measurement accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables precise determination of both radiator and room air temperatures, enhancing measurement accuracy and suitability for a wide range of applications, including low-temperature heating systems, while minimizing production costs and times through automated production processes.
Implementation Method 1
A thermally insulating element, which is arranged between the room air temperature sensor and the back, is assigned to the room air temperature sensor
Implementation Method 2
employing a central main circuit board for reduced heat transfer and space for data transmission components
Data Source
Figure 1~3
Figure 4~5
Figure 6
AI summary
The invention relates to a heat cost allocator (1) with a housing (4) which has a front part (4.1) and a rear side (4.2) of the housing, with a radiator temperature sensor (2), a room air temperature sensor (3) and a main printed circuit board (6). According to the invention, the main printed circuit board (6) is arranged in the longitudinal direction of the heat cost allocator (1) in the housing (4) and a sensor printed circuit board (7) is arranged perpendicular to this main printed circuit board (6), with a first end (7.1) of the sensor printed circuit board (7) in a Through-contact opening (10) of the main printed circuit board (6) is arranged and a second end (7.2) of the sensor printed circuit board (7) is arranged in the area of the housing front part (4.1), the sensor printed circuit board (7) being connected to the main printed circuit board (6) in the area of the through-contact opening ( 10) is electrically contacted via main printed circuit board contacts (9) and sensor printed circuit board contacts (8), and the room air temperature sensor (3) is arranged on the second end (7.2) of the sensor printed circuit board (7).