Low-Temperature Heat Applied RFID Sensor Tag
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Solution Overview
Problem
Conventional RFID tags for theft prevention are easily removable and require high temperatures and extended time for application, making them unsuitable for manufacturing and potentially damaging to products.
Innovation Solution
A thin, flexible RFID tag system applied using a low-temperature heat source below 170°C for less than 60 seconds, with a structure comprising a top layer, sensor layer, adhesive layer, and optional heat protective layer, allowing discreet and efficient attachment to textiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional high-temperature heat source above 170°C is applied for 60-90 seconds to affix RFID tag, then the RFID tag adheres to the product, but the sensor and/or product may be damaged and the RFID tag may stick to the heat source
Solution Approach 1:
The patent changes the thermal parameters by using a lower temperature heat source (below 170°C) and shorter application time (less than 60 seconds) while maintaining effective adhesion through optimized adhesive composition and heat distribution, thereby avoiding thermal damage to the sensor and product
Solution Approach 2:
The patent introduces an intermediary adhesive layer with specific thermal and adhesive properties that enables bonding at lower temperatures, acting as a mediator between the RFID tag and the product to achieve reliable adhesion without requiring high temperatures that would cause damage
2Reliability
If conventional high-temperature heat source is applied for extended time, then the RFID tag adheres to the product, but the RFID tag may stick to the heat source and not adhere to the product
Solution Approach 1:
The patent optimizes the combination of temperature and time parameters by using moderate temperature (below 170°C) with short duration (less than 60 seconds), changing the process parameters to achieve effective adhesion without the drawbacks of extended high-temperature exposure
Solution Approach 2:
The patent replaces the conventional high-temperature thermal bonding mechanism with a lower-temperature adhesive-based bonding mechanism, substituting the thermal field with a chemical-adhesive field that achieves bonding under milder conditions
3Reliability
If RFID tag is made visible and easily accessible for theft prevention, then theft detection is enabled, but thieves can easily locate and remove or disable the RFID element
Solution Approach 1:
The patent segments the RFID tag into multiple functional layers (adhesive layer, RFID element layer, protective layer) that work together to provide both secure attachment and theft detection capability, with each layer serving a specific function in the overall security system
Solution Approach 2:
The patent uses a thin, flexible protective layer that covers the RFID element, making it difficult to locate and remove while maintaining the tag's functionality, effectively protecting the sensitive components from theft attempts
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, discreet, and damage-free attachment of RFID tags to textiles, enhancing theft prevention while being compatible with manufacturing processes and product durability.
Implementation Method 1
applying a heat source at a temperature to the sensor tag for a time period
Data Source
AI summary
A method for configuring a sensor tag includes placing the sensor tag in a location on a garment or fabric to be affixed. The method may further include applying a heat source at a temperature to the sensor tag for a time period. The method may further include removing the heat source after the time period has elapsed. The method may further include removing a paper layer between an adhesive layer and the garment of fabric prior to placing the sensor taking in the location. The method may further include removing a top protective layer after removing the heat source.