Heat-Conducting Assembly Layout for Electronic Device Warpage Control
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Solution Overview
Problem
Electronic devices face challenges in heat dissipation, leading to warpage during manufacturing, which affects their reliability.
Innovation Solution
The electronic device design includes a first heat-conducting assembly with a specific area ratio to the electronic unit, greater than or equal to 1 and less than 9.8, enhancing heat dissipation and reducing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation is improved by increasing the area of the heat-conducting assembly, then heat dissipation efficiency is improved, but device area is excessively occupied
Solution Approach 1:
The patent applies parameter changes by optimizing the area ratio of the heat-conducting assembly to the electronic unit within a specific range (greater than or equal to 1 and less than 9.8). This parameter optimization ensures sufficient heat dissipation area while preventing excessive occupation of device area, resolving the contradiction between heat dissipation efficiency and area utilization.
2Reliability
If heat dissipation is improved, then warpage is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent uses parameter changes by defining a specific area ratio range for the heat-conducting assembly (greater than or equal to 1 and less than 9.8 relative to the electronic unit). This parameter control achieves effective warpage reduction through improved heat dissipation while maintaining manageable manufacturing complexity by avoiding overly complex structural designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improved heat dissipation efficiency reduces warpage and enhances structural reliability of electronic devices.
Implementation Method 1
The first heat-conducting assembly is disposed on the second side of the encapsulation layer... improving the heat dissipation effect
Data Source
AI summary
An electronic device and a method for manufacturing the same are provided. The electronic device includes an electronic unit, an encapsulation layer, a circuit structure, and a first heat-conducting assembly is provided. The encapsulation layer surrounds the electronic unit and has a first side and a second side opposite to each other. The circuit structure is disposed on the first side of the encapsulation layer and is electrically connected to the electronic unit. The first heat-conducting assembly is disposed on the second side of the encapsulation layer. Viewing in a top view, the first heat-conducting assembly has a first area, the electronic unit has a second area, and a ratio of the first area to the second area is greater than or equal to 1 and less than 9.8.