Heat Attenuator for Rotary Substrate Processing Apparatus

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Solution Overview

Problem

The rotary substrate processing apparatus faces challenges due to thermal expansion of metal components, leading to positional deviations and potential particle generation from the difference in thermal expansion coefficients between metal and non-metal parts.

Innovation Solution

Incorporation of a heat attenuator using fine quartz particles coated on surfaces where metal and non-metal parts with different thermal expansion coefficients are adjacent, to attenuate thermal energy and reduce thermal expansion, thereby minimizing positional shifts and particle generation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If metal materials are used for the container and support portion to withstand the weight of 300 mm substrates arranged in the circumferential direction, then the strength and weight-bearing capacity are improved, but thermal expansion occurs during heat treatment, leading to positional deviation of components

Engineering Contradiction:
Improveweight-bearing capacityVSAvoidpositional accuracy
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent applies thermal insulation materials (asbestos board, glass wool, or air layers) to change the thermal parameters of the container and support portion, reducing heat absorption during substrate heating. This parameter change prevents thermal expansion of metal components, thereby maintaining positional accuracy while preserving the required strength and weight-bearing capacity.

Inventive Principle:
Principle #35Parameter changes

2Strength

If metal materials are used for the container and support portion, then the structural strength is improved, but the difference in thermal expansion coefficients between metal and non-metal parts generates harmful factors such as particle generation

Engineering Contradiction:
Improvestructural strengthVSAvoidparticle generation
Core Design Contradiction:
StrengthVSObject-generated harmful factors

Solution Approach 1:

By introducing thermal insulation materials, the patent changes the thermal parameters of the system to reduce temperature differential between metal and non-metal parts. This parameter change minimizes differential thermal expansion, preventing particle generation from material delamination or structural failure while maintaining the required structural strength.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The heat attenuator effectively reduces thermal energy applied to metal parts, suppressing thermal expansion and preventing positional changes and particle diffusion into the process chamber, thus maintaining process integrity and reducing contamination.

Implementation Method 1

a heat attenuator using fine quartz particles coated on surfaces where metal and non-metal parts with different thermal expansion coefficients are adjacent, to attenuate thermal energy and reduce thermal expansion

Methodology Applied
Scientific EffectThermal radiation absorption: Absorption (EM radiation)

Implementation Method 2

The heat attenuator effectively reduces thermal energy applied to metal parts, suppressing thermal expansion and preventing positional changes and particle diffusion into the process chamber

Methodology Applied
Scientific EffectThermal energy attenuation: Thermal Insulation

Data Source

PatentUS10685832B1Substrate processing apparatus
Publication Date: 2020.06.16 KOKUSAI DENKI KK
  • US10685832B1 patent drawing
  • US10685832B1 patent drawing
  • US10685832B1 patent drawing

AI summary

There is provided a technique that includes a metal container including a process chamber configured to process a substrate, a substrate mounting plate rotatably installed in the container and having a plurality of substrate mounting surfaces circumferentially arranged at an upper surface thereof, a heater configured to heat the substrate mounted on each of the plurality of substrate mounting surfaces, a heat attenuator installed between the heater and the container, a gas supply part configured to supply a gas to the process chamber, and a support part configured to rotate the substrate mounting plate.