Heat Bypass Path for Logic LSI Thermal Management in DRAM Modules
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Solution Overview
Problem
In semiconductor devices, the heat generated by logic LSIs such as CPUs or GPUs is often transferred to DRAMs, leading to excessive temperature rises and uneven temperature distributions, which can cause abnormal operations and damage to DRAM elements.
Innovation Solution
A heat bypass path is introduced between the logic LSI and the heat radiating member, bypassing the DRAM, to efficiently transfer heat away from the DRAM, thereby preventing temperature rises and distributions that could lead to operational issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is radiated from above the DRAM through a heat radiating member, then heat from the logic LSI can be dissipated, but the DRAM temperature rises and exceeds allowable limits causing abnormal operations
Solution Approach 1:
The heat radiation function is segmented into two independent paths: one path through the DRAM for DRAM heat dissipation, and another path through the heat bypass path for logic LSI heat dissipation. This segmentation allows each component to have dedicated heat management, preventing logic LSI heat from raising DRAM temperature while maintaining overall heat dissipation efficiency.
Solution Approach 2:
The heat bypass path acts as an intermediary thermal conduction path between the logic LSI and the heat radiating member. It provides a dedicated thermal pathway that bypasses the DRAM, allowing logic LSI heat to be transferred to the heat radiating member without passing through the DRAM, thus protecting DRAM from excessive temperature rise.
2Temperature
If heat from the logic LSI is transferred through the DRAM to the heat radiating member, then heat dissipation is achieved, but temperature distribution spreads causing element characteristic variations
Solution Approach 1:
The thermal conduction path is segmented into separate routes: heat from the logic LSI is conducted through the heat bypass path directly to the heat radiating member, while DRAM heat is conducted through the DRAM to the heat radiating member. This segmentation prevents heat from the logic LSI from spreading through the DRAM, thereby maintaining uniform temperature distribution and stable element characteristics in the DRAM.
Solution Approach 2:
The heat bypass path serves as an intermediary thermal pathway that intercepts heat from the logic LSI before it can spread into the DRAM. By providing this intermediate heat transfer route, the patent prevents thermal stress and element characteristic variations in the DRAM while maintaining efficient heat dissipation from the logic LSI.
3Temperature
If a heat radiating member is disposed above the DRAM, then heat radiation capability is improved, but the structure becomes complex and space is consumed
Solution Approach 1:
The heat radiating member is merged with the interposer structure, integrating the heat radiation function into the existing substrate that already provides electrical interconnection. This merging eliminates the need for a separate heat radiation component, reducing device complexity and space consumption while maintaining effective heat radiation capability through the integrated structure.
Solution Approach 2:
The interposer is designed to serve multiple functions: electrical interconnection between the logic LSI and DRAM, structural support, and heat radiation. By making the interposer multi-functional, the patent eliminates the need for separate dedicated heat radiation components, thereby reducing overall device complexity while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses abnormal operations and element characteristic variations in DRAMs by redirecting heat away from the DRAM, ensuring it is radiated efficiently without exceeding allowable temperature limits.
Implementation Method 1
Heat generated from the logic LSI such as a CPU or a GPU is transferred to the heat radiating member through the interposer and the DRAM and then radiated from the heat radiating member
Implementation Method 2
Heat generated from the logic LSI such as a CPU or a GPU is transferred to the heat radiating member through the interposer and the DRAM and then radiated from the heat radiating member
Data Source
AI summary
Between a logic LSI (4) arranged on one side of a DRAM (1) and jointed to the DRAM and a radiating member (6) arranged on the other side of the DRAM (1) for irradiating the heats of the DRAM (1) and the logic LSI (4), there is disposed a heat bypass passage (5), which extends inbetween while bypassing the DRAM (1). Thus, it is possible to provide a semiconductor device, which can irradiate the heat generated from the logic LSI such as CPU or GPU thereby to reduce the temperature rise and the temperature distribution.