Heat Column Design with Integrated Wick Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat column manufacturing is costly and wasteful due to forging processes and inefficient wick structures, leading to suboptimal heat dissipation efficiency.
Innovation Solution
A heat column design with a column body and base that are integrally formed, reducing soldering procedures and increasing heat exchange area through a specially structured base with wick structures and a high thermal conductive material, along with heat dissipation fins for enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional forging process is used to manufacture column body, then manufacturing precision is achieved, but manufacturing cost increases and waste generation exceeds 50%
Solution Approach 1:
The patent changes the manufacturing method from conventional forging to die-casting process, altering the production parameters to reduce material waste and manufacturing cost while maintaining column body precision requirements
Solution Approach 2:
The patent adopts a die-casting process that uses disposable molds rather than expensive reusable forging dies, reducing the initial manufacturing cost and waste generation despite potentially lower reusability
2Strength
If multiple soldering procedures are used to assemble column body and top cover, then connection strength is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent integrates the column body and top cover into a single integrally formed component through die-casting, eliminating the need for separate soldering procedures while maintaining structural strength and simplifying the assembly process
Solution Approach 2:
The integrally formed column body performs multiple functions simultaneously - providing structural support, thermal conduction pathways, and sealed enclosure - without requiring separate assembled components
3Ease of manufacture
If wick structure is manufactured together with base by powder sintering, then manufacturing process is simplified, but heat exchange area is reduced due to lack of wick structure on top cover internal surface
Solution Approach 1:
The patent divides the wick structure into separate components - a wick structure on the base and a separate wick structure on the top cover internal surface - allowing each to be optimized independently while maximizing total heat exchange area
Solution Approach 2:
The patent extends the wick structure from the base upward along the top cover internal surface, utilizing the vertical dimension and internal surface area of the top cover to create additional heat exchange pathways
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies assembly, reduces waste, and improves heat dissipation efficiency by minimizing thermal resistance and enhancing the heat exchange area, thereby effectively managing heat generated by electronic devices.
Implementation Method 1
Wick structures 16a and 16b are disposed on the inner wall of the column body 12
Implementation Method 2
A heat pipe can transfer heat over a long distance with a small cross section and under minor temperature differences
Implementation Method 3
a heat sink transfers heat generated by the electronic device and then the heat is dissipated to the exterior via fins thereon by natural or forced convection
Implementation Method 4
The heat pipe can transfer heat over a long distance with a small cross section and under minor temperature differences
Data Source
AI summary
A heat dissipation module includes a heat column and a plurality of heat dissipation fins disposed outside of the heat column and connected with the heat column. The heat column has a column body and a base, and the column body has a top portion and a sidewall ringed with the top portion. The sidewall and the top portion are integrally formed. The base is disposed opposite to the top portion, and the base has an indentation for allowing an end of the sidewall of the column body to insert so as to form a closed space between the base and the column body. The base further has an annular protrusion close to the indentation, and after the end of the sidewall of the column body is inserted into the indentation of the base, the annular protrusion is processed to be filled between the indentation and the sidewall so as to tightly assemble the base and the column body.