Heat-Conducting Mounting Socket for Network Device Thermal Dissipation
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Solution Overview
Problem
Network devices, such as wireless access points, often fail due to heat buildup without proper ventilation, as they are typically attached to installation surfaces without adequate heat dissipation methods.
Innovation Solution
A mounting socket system that incorporates a heat-conducting socket with a top and bottom portion, allowing the network device to be inserted from one side of the installation surface, where the socket dissipates heat to the opposite side, utilizing heat-conducting materials like aluminum and featuring fingers and flanges to draw heat away from the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the network device is attached directly to the installation surface using straps or brackets, then the device is securely mounted, but heat buildup causes the device to fail
Solution Approach 1:
The patent introduces a mounting socket as an intermediary component between the network device and the installation surface. This socket includes a heat-conducting member that contacts the device and a heat-dissipating member that extends to the installation surface, serving as a thermal bridge to transfer heat away from the device while maintaining secure mounting.
Solution Approach 2:
The patent converts the harmful effect of heat buildup into a beneficial thermal conduction path. By incorporating heat-conducting materials in the mounting socket, the previously problematic heat is channeled through the mounting structure to the installation surface, transforming the mounting system from a heat-trapping element into an active heat-dissipation mechanism.
2Temperature
If the network device is disposed at a safe distance from the installation surface to provide ventilation, then heat dissipation is improved, but the mounting security and stability are reduced
Solution Approach 1:
The patent transitions from a single-dimensional mounting approach (direct attachment) to a multi-dimensional thermal management system. The mounting socket extends thermally in multiple directions - contacting the device internally while dissipating heat externally to the installation surface - creating a three-dimensional heat conduction pathway that maintains both thermal performance and mechanical strength.
3Device complexity
If traditional mounting methods are used without heat dissipation features, then the mounting structure is simple, but the device experiences overheating and failure
Solution Approach 1:
The mounting socket is designed to perform multiple functions simultaneously: mechanical mounting of the device, thermal conduction from the device, and heat dissipation to the installation surface. This multi-functional design integrates mounting and thermal management into a single component, avoiding the need for separate ventilation structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively transfers heat away from the network device, preventing overheating and extending the device's operational lifespan by dissipating heat through the installation surface, thus ensuring better ventilation and performance.
Implementation Method 1
The socket may be made of heat conducting material... When the network device is inserted into the socket, the socket dissipates heat generated by the circuitry
Data Source
AI summary
A socket for mounting a network device is provided. The socket includes a top portion and a bottom portion. The top portion and bottom portion are sized to engage with a network communication device that may be inserted into an interior of the socket from a first side of an installation surface. The top portion and bottom portion may be operable to draw heat away from the network device and release the heat on a second side of the installation surface.