Heat Conducting Pillar for Portable Electronic Device Thermal Management
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Solution Overview
Problem
Portable electronic devices face challenges in heat dissipation due to their miniaturized design, leading to unstable operation as generated heat cannot be effectively dissipated within limited internal spaces.
Innovation Solution
Incorporating a heat conducting pillar between the upper and lower covers of the device, which can be a solid or hollow structure with ventilation holes, connected to a fan to enhance heat exchange and balance temperatures, thereby improving heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the internal space of portable electronic devices is reduced for miniaturization, then the device size is reduced, but the heat dissipation space is limited
Solution Approach 1:
The patent introduces a vertical heat conduction dimension by placing high-thermal-conductivity materials (such as metal pillars or graphite sheets) between the upper and lower covers. This vertical thermal pathway allows heat to be conducted from the heat-generating component to the outer shell in the thickness direction, effectively utilizing the Z-axis dimension for heat dissipation without increasing the planar area of the device.
2Temperature
If a heat dissipation module is added to enhance heat dissipation effect, then heat dissipation efficiency is improved, but the device complexity increases
Solution Approach 1:
The patent integrates the heat dissipation function directly into the existing structural components of the device. The upper and lower covers serve dual purposes: as structural enclosure elements and as heat dissipation surfaces. High-thermal-conductivity materials are embedded within or between these covers, merging the structural and thermal management functions into a unified design, thereby avoiding additional complex heat dissipation modules.
3Reliability
If heat is not dissipated effectively, then the device operates in unstable state, but adding heat dissipation structures increases the device volume
Solution Approach 1:
The patent applies high-thermal-conductivity materials selectively in critical heat conduction pathways rather than uniformly throughout the entire device structure. For example, metal pillars or graphite sheets are placed specifically between the processor and the outer shell where heat flow is most needed, providing localized thermal management enhancement without requiring a proportional increase in overall device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat conducting pillar effectively balances temperature distribution within the device, enhancing heat dissipation efficiency by increasing the heat exchange area and airflow, as demonstrated by simulation results showing improved performance in experimental examples.
Implementation Method 1
a heat conducting pillar... connected to the upper cover and the lower cover to balance the temperatures of the upper cover and the lower cover
Implementation Method 2
the air outside the electronic device is guided into the electronic device through the passage by the fan, and then the air is exhausted through the holes and flows along the path provided by the fan
Data Source
AI summary
An electronic device includes an upper cover, a lower cover combined with the upper cover, and a heat conducting pillar. An accommodating space is formed by the upper cover and the lower cover. The heat conducting pillar is disposed in the accommodating space and physically connected with the upper cover and the lower cover to balance the temperature of the upper cover and the lower cover.