Heat Conducting Sheet With Partial Bonding Layer

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Solution Overview

Problem

High heat-conducting sheets with full bonding layers tend to cause warps or distortions when bonded to reflective sheets, and partial bonding layers result in a weak holding force, leading to dislocation during processing and shape formation.

Innovation Solution

A heat conducting sheet design featuring a first sheet with a partial bonding layer and a backing separator with slight adhesion, where the bonding force between the sheet and the bonding layer is stronger than between the backing separator and the bonding layer, allowing for stable adhesion and processing without warps or distortions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a bonding layer is provided on the entire high heat-conducting sheet, then the holding force between the sheet and backing separator is strong, but warps or distortions are produced on the reflective sheet when bonded

Engineering Contradiction:

Improveholding forceVSAvoidwarp or distortion

Core Design Contradiction:

StrengthVSShape

Solution Approach 1:

The bonding layer is divided into multiple separate bonding regions rather than being continuous. This segmentation reduces the overall bonding area between the heat-conducting sheet and reflective sheet, thereby minimizing warps and distortions while maintaining sufficient holding force through strategically positioned bonding regions.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the heat-conducting sheet are assigned different functions: some regions have bonding layers for strong adhesion, while other regions have no bonding layer to prevent warping. This local differentiation allows the system to simultaneously achieve strong holding force where needed and minimal distortion where bonding is omitted.

Inventive Principle:

Principle #3Local quality

2Shape

If a partial and smaller bonding layer is used, then warps or distortions are reduced, but the holding force between the high heat-conducting sheet and backing separator becomes weak, causing dislocation during processing

Engineering Contradiction:

Improvewarp or distortionVSAvoidholding force

Core Design Contradiction:

ShapeVSStrength

Solution Approach 1:

The backing separator is bonded to the entire surface of the heat-conducting sheet before the bonding layer is applied. This preliminary bonding provides initial holding force that prevents dislocation during processing, while the subsequent partial bonding layer provides additional strength without causing excessive warping.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The bonding system transitions from a static full-bonding approach to a dynamic two-stage bonding process: first bonding the backing separator to the entire sheet surface, then adding selective bonding layers in specific regions. This dynamic approach allows optimization of both holding force and shape stability at different stages.

Inventive Principle:

Principle #15Dynamics

3Strength

If the bonding force between the first sheet and bonding layer is strong, then the bonding layer adheres well to the sheet, but the backing separator cannot be easily peeled off

Engineering Contradiction:

Improvebonding forceVSAvoidpeeling ease

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

Different adhesive properties are assigned to different interfaces: the bonding layer has strong adhesion to the first sheet for secure bonding, while the backing separator has slight adhesion that allows easy peeling. This local differentiation of adhesive characteristics resolves the contradiction between strong bonding and easy peeling.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The bonding layer is applied partially rather than fully, covering only specific regions where strong bonding is needed. This partial application ensures strong adhesion where required while leaving other areas with only the slight adhesion of the backing separator, maintaining peeling ease.

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The sheet can be easily processed into a predetermined shape without warps or distortions and securely bonded to reflective sheets, effectively preventing heat spot formation in electronic devices.

Implementation Method 1

a backing separator formed on the first face entirely and having slight adhesion

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

The bonding force between the first sheet and the bonding layer is greater than the bonding force between the backing separator and the bonding layer

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Implementation Method 3

a first sheet having heat conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9488420B2Heat conducting sheet

Publication Date: 2016.11.08 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

AI summary

A heat conducting sheet includes a first sheet having heat conductivity, a bonding layer disposed on a part of a first face of the first sheet, and a backing separator disposed on the first face entirely. The backing separator has slight adhesion, so that the first sheet can stick to the backing separator. Bonding force between the first sheet and the bonding layer is greater than bonding force between the backing separator and the bonding layer.