Heat-Conducting Assembly with Through-Hole for Mobile Thermal Management
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Solution Overview
Problem
Mobile devices face challenges in effectively dissipating heat generated by components like CPUs, leading to increased temperatures and potential damage to surrounding components.
Innovation Solution
A heat-conducting assembly featuring a middle frame with through holes and a heat-conducting structure that includes a conductor and heat insulator, which directs heat away from the CPU to a heat dissipation part, reducing contact area and temperature, and optionally incorporates phase change structures for enhanced heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat source is directly attached to the middle frame for heat dissipation, then heat dissipation efficiency is improved, but the temperature of surrounding components on the middle frame increases causing thermal damage
Solution Approach 1:
The patent segments the heat dissipation path by introducing a through-hole in the middle frame that separates the heat source attachment area from the surrounding component areas. The heat-conducting structure is positioned within this through-hole, creating distinct thermal zones that allow efficient heat removal from the CPU while isolating other components from excessive heat.
Solution Approach 2:
The patent introduces an intermediary structure (the heat-conducting assembly within the through-hole) that mediates between the heat source and the middle frame. This intermediary conducts heat away from the CPU through a controlled path while the heat insulator prevents excessive heat from reaching surrounding components, thus resolving the contradiction between heat dissipation efficiency and thermal protection.
2Object-affected harmful factors
If a heat-conducting structure with through-hole is used to direct heat away from CPU, then thermal protection of components is improved, but device structure complexity increases
Solution Approach 1:
The patent merges multiple functions into a single integrated heat-conducting assembly that includes the conductor, heat insulator, and through-hole structure. This assembly simultaneously provides heat conduction, thermal insulation, and structural support, thereby reducing overall device complexity while achieving effective thermal management.
Solution Approach 2:
The heat-conducting structure serves multiple functions: it conducts heat from the CPU, provides thermal insulation to protect surrounding components, and maintains structural integrity of the middle frame. This multi-functionality reduces the need for separate components, thereby simplifying the overall device structure while addressing thermal protection requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the temperature of the heat source and surrounding components by 3-5 degrees Celsius, minimizing thermal impact and improving overall device performance.
Implementation Method 1
The conducting part includes a conductor and a heat insulator. The conductor is connected to the heat dissipation part, and the conductor is fastened in the first through hole through the heat insulator, and is in contact with a heat source
Implementation Method 2
the conductor is fastened on the middle frame through the heat insulator, and the heat insulator can insulate from heat of the conductor
Implementation Method 3
heat generated by the heat source can be conducted to the conductor, and then conducted by the conductor to the heat dissipation part for heat dissipation
Data Source
AI summary
A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.