Heat Conduction Board for High-Density Electronic Component Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic component mounting methods face challenges in reducing noise interference and achieving high-density mounting without the use of wire-bonding processes, while also limiting the ability to mount components on both sides of a printed circuit board.
Innovation Solution
A heat conduction board design featuring a metal plate, resin layer, lead frame, and printed circuit board, where the power semiconductor device and control circuit are directly soldered to the lead frame, eliminating the need for wire-bonding and allowing for high-density mounting on both sides by using a heat dissipation member and a wire pattern lead frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire-bonding process is used to connect electronic components, then electrical connection is achieved, but noise interference increases and manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the wire-bonding process from the mounting structure. By directly mounting electronic components onto the lead frame without intermediate bonding wires, the source of noise interference and manufacturing complexity is removed while maintaining reliable electrical connection through the solder joints between components and lead frame terminals.
Solution Approach 2:
The patent merges the functions of the lead frame (heat dissipation, electrical connection, and mechanical support) with the mounting structure. By integrating these functions into a single lead frame component rather than using separate wires and mounting structures, the design achieves reliable electrical connection while reducing noise and simplifying manufacturing.
2Ease of manufacture
If electronic components are mounted on one surface of printed circuit board, then manufacturing is simplified, but high-density mounting cannot be achieved
Solution Approach 1:
The patent transitions from two-dimensional mounting (single surface of PCB) to three-dimensional mounting by utilizing both surfaces of the lead frame structure. Electronic components are mounted on the front surface while additional components can be mounted on the back surface, effectively adding a third dimension to the mounting space and achieving high-density packaging without complicating the manufacturing process.
3Temperature
If lead frame is used for heat dissipation and mounting, then heat conduction is improved, but component density is limited
Solution Approach 1:
The patent utilizes the three-dimensional structure of the lead frame to mount components on both front and back surfaces, effectively doubling the component density while maintaining the lead frame's heat dissipation function. The lead frame continues to conduct heat from components on both surfaces to the heat dissipation structure, achieving high density without sacrificing thermal management capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces noise interference, simplifies the manufacturing process, and enables high-density, high-performance mounting of electronic components on both sides of the circuit board, effectively addressing the limitations of previous technologies.
Implementation Method 1
a heat conduction member (20), arranged on the heat dissipation member (10), and conducting a heat to the heat dissipation member (10)
Implementation Method 2
the power semiconductor device (40) and the printed circuit board (60) are directly connected with the lead frames (30) by using the solder (70)
Data Source
AI summary
A heat conduction board, include a heat dissipation member; a heat conduction member which is arranged on the heat dissipation member and conducts a heat thereto; a lead frame which is formed in a wire pattern shape, and is arranged on the heat conduction member; and a printed circuit board which mounts a second electronic component for controlling a first electronic component; wherein the first electronic component and the printed circuit board are soldered to the lead frame.